Semiconductor Device With Inner Surface Holes for Size Reduction
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Solution Overview
Problem
Existing semiconductor devices with encapsulated semiconductor elements face challenges in reducing their size due to the need for extensive hole distribution and external lead terminals, which increases the overall device size and complexity.
Innovation Solution
A semiconductor device design featuring an encapsulation member with openings on the semiconductor element's surface, allowing for direct electrical connection to external structures via these openings, reducing the required space and size of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If holes are provided on the outer circumferential side to reach the lead terminal, then electric connection is established, but the substrate size and semiconductor device size increase
Solution Approach 1:
The invention changes the spatial arrangement of holes from the outer circumferential side (peripheral dimension) to the inner side (central dimension) of the semiconductor element. This dimensional repositioning allows holes to be distributed within a smaller radius from the center, reducing the substrate area required while maintaining electrical connection functionality.
Solution Approach 2:
The invention merges the functions of the lead terminal and the holes by allowing the lead terminal to extend through the holes that are positioned on the inner side of the semiconductor element. This integration eliminates the need for separate peripheral lead terminal structures, thereby reducing the overall device size.
2Reliability
If resin mold and lead terminal are provided on the outer circumferential side, then electric connection is established, but the semiconductor device size increases
Solution Approach 1:
The invention repositions the holes from the outer circumferential region to the inner region of the semiconductor element, changing the spatial dimension of hole distribution. This allows the lead terminal and resin mold to be configured more compactly, reducing the overall volume of the semiconductor device while maintaining electrical connection reliability.
Solution Approach 2:
Instead of placing holes on the outer circumferential side as in conventional designs, the invention inverts this arrangement by positioning holes on the inner side of the semiconductor element. This inverted configuration enables more compact device packaging and reduces the volume occupied by the resin mold and lead terminal structures.
Data Source
AI summary
A power module includes: an encapsulation-target portion having at least one semiconductor element; and an encapsulation member that has first and second planes between which the encapsulation-target portion is interposed, and that encapsulates the encapsulation-target portion. The encapsulation member has, on the at least one semiconductor element, at least one opening that exposes part of a surface of the encapsulation-target portion the surface being on a side of the first plane. Thus, a semiconductor device of which size can be reduced can be provided.