Semiconductor Device Inner Lead Signal Switching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices with flip chip packaging face challenges in changing the signal supplied to specific terminals without altering the package design, particularly in thin packages like TAB (tape automated bonding) where wire bonding is essential, leading to thickness issues and limitations in applying previous switching methods.
Innovation Solution
A semiconductor device with an IC chip and package that includes an inner lead portion with a pattern allowing the signal to be changed by aligning the IC chip with pitch alignment marks, enabling the selection of operation modes during packaging without modifying the package design, using bumps for electrical coupling and encapsulation resin for mechanical bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wire bonding is used to switch signals in traditional semiconductor devices, then signal switching capability is achieved, but package thickness increases
Solution Approach 1:
The patent extracts the signal switching function from the external wire bonding process and relocates it to the internal lead structure. The inner lead is designed with multiple connection points that can be selectively connected to different pads on the IC chip, enabling signal switching without requiring external wire bonding. This extraction of the switching function from the external domain to the internal domain resolves the thickness issue while maintaining versatility.
Solution Approach 2:
The inner lead serves as an intermediary element between the external terminal and the IC chip pads. It provides multiple connection points and can be selectively connected to different pads, acting as a mediator that enables signal switching functionality. This intermediary structure allows the package to achieve adaptability without increasing thickness, as the switching capability is embedded within the lead structure itself rather than requiring external wiring.
2Adaptability or versatility
If the coupling substrate or external device is changed to switch operation modes, then user-specific functions can be achieved, but manufacturing costs and development time increase
Solution Approach 1:
The inner lead is designed with multi-functionality, serving both as a structural connection element and as a signal switching mechanism. By incorporating multiple connection points on the inner lead that can be selectively connected to different IC chip pads, a single universal package design can support multiple operation modes. This eliminates the need for different coupling substrates or external devices for different functions, thereby reducing manufacturing costs and development time while maintaining adaptability.
Data Source
AI summary
A semiconductor device in which a flip chip is mounted which can change a potential of a specific terminal without changing a design of a package external. The semiconductor device includes an IC chip having a bump for an external terminal, and a package in which the IC chip is mounted. The package includes an inner lead portion that supplies a first signal or a second signal to the external terminal. The inner lead portion has a pattern of an inner lead that can change a signal to be supplied to the external terminal to the first signal or the second signal according to a position at which the IC chip is mounted.