Semiconductor Inspection Circuit Pair for Process Variation Detection

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Solution Overview

Problem

Existing semiconductor process evaluation methods fail to accurately detect and quantify process variations, particularly those that affect specific characteristics of semiconductor devices.

Innovation Solution

An inspection system is employed that includes a semiconductor substrate with first and second inspection circuits, each with different sensitivities to process variations, allowing for the measurement and estimation of these variations through a measurer and estimator system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple inspection circuits with different sensitivities are formed on the semiconductor substrate, then process variation detection accuracy is improved, but device complexity increases

Engineering Contradiction:

Improveprocess variation detection accuracyVSAvoidinspection circuit complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The inspection system divides the measurement function into multiple specialized inspection circuits (first inspection circuit and second inspection circuit), each optimized for detecting specific types of process variations with different sensitivities. This segmentation allows accurate detection of various process parameters while keeping each individual circuit relatively simple in structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple inspection circuits with different sensitivities are integrated on the same semiconductor substrate, creating a universal inspection system that can detect multiple types of process variations simultaneously. This multi-functional approach improves overall measurement precision without requiring separate inspection systems for different variation types.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Measurement precision

If inspection circuits with different sensitivities to process variation are used, then specific characteristic detection is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvespecific characteristic detectionVSAvoidinspection system manufacturing

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

Different regions of the semiconductor substrate are equipped with inspection circuits having locally optimized sensitivities matched to the specific characteristics being measured in those regions. This local quality approach allows each inspection circuit to be tailored for its specific measurement task, improving detection precision while maintaining manufacturing feasibility through standardized circuit design patterns.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS20250306083A1Inspection system

Publication Date: 2025.10.02 TOKYO ELECTRON LTD

AI summary

An inspection system includes a semiconductor substrate on which a first inspection circuit and a second inspection circuit are formed, a measurer configured to measure a predetermined characteristic in each of the first inspection circuit and the second inspection circuit, and an estimator configured to estimate process variation when the first inspection circuit and the second inspection circuit are formed on the semiconductor substrate, based on a first measurement result obtained by the measurer measuring the first inspection circuit and a second measurement result obtained by the measurer measuring the second inspection circuit. A magnitude of a variation of the characteristic with respect to the process variation in the second inspection circuit differs from a magnitude of a variation of the characteristic with respect to the process variation in the first inspection circuit.