Semiconductor Electrode Layout With Insulating Layer Isolation

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Solution Overview

Problem

Existing semiconductor devices with electrodes on the same surface require large distances between conductor members to ensure electrical insulation, leading to increased device size.

Innovation Solution

A semiconductor device configuration with a conductor circuit pattern on an insulating layer interposed between conductor plates and lines, ensuring electrical insulation without the need for large distances, using insulating layers to separate conductor plates and lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If large distances are maintained between conductor members, then electrical insulation is ensured, but device size increases

Engineering Contradiction:

Improveelectrical insulationVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

An insulating layer is introduced as an intermediary substance between conductor members (conductor plate and conductor lines) to provide electrical insulation. This allows conductor members to be positioned closer together without direct contact, reducing device size while maintaining insulation reliability through the mediating insulating material.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If conductor members are positioned close together, then device size is reduced, but unintended contact and short circuits occur

Engineering Contradiction:

Improvedevice sizeVSAvoidelectrical insulation

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The insulating layer serves as a protective intermediary that physically separates conductor members, preventing unintended contact and short circuits even when conductors are positioned in close proximity, thus enabling compact device design without compromising electrical insulation reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

A thin film insulating layer is applied to the conductor plate surface, providing effective electrical isolation in a minimal thickness. This thin film approach enables close spacing of conductor members while maintaining reliable insulation, directly addressing the contradiction between compact size and electrical safety.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS12581969B2Semiconductor device

Publication Date: 2026.03.17 DENSO CORP

AI summary

A semiconductor device includes a semiconductor element having a surface on which a first electrode and a second electrode are disposed, a conductor plate having a surface facing the surface of the semiconductor element and electrically connected to the first electrode, an insulating layer disposed on the surface of the conductor plate and covers a part of the surface of the conductor plate, and a conductor circuit pattern disposed on the insulating layer. The conductor circuit pattern has at least one conductor line electrically connected to the semiconductor element. The at least one conductor line includes a conductor line electrically connected to the second electrode.