Semiconductor Package Intermediate Connection Structure
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Solution Overview
Problem
Semiconductor packages face issues with cracks in external connection terminals due to differences in thermal expansion with external devices like printed circuit boards, leading to stress and fatigue-related problems.
Innovation Solution
A semiconductor package structure is developed with an intermediate connection structure that includes a semiconductor chip, a protective layer, an insulating pattern, and an external connection terminal, which reduces thermal expansion differences with external devices, enhancing stress distribution and crack resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor package is mounted on a board, then electrical connection is achieved, but thermal expansion difference causes cracks in external connection terminals
Solution Approach 1:
The patent introduces an intermediate connection structure comprising an insulating pattern and external pad between the semiconductor chip and board. This intermediate structure acts as a mediator that absorbs and distributes thermal stress, reducing the direct thermal expansion difference between the semiconductor package and board, thereby preventing cracks in external connection terminals.
Solution Approach 2:
The intermediate connection structure uses composite materials including insulating patterns and external pads with specific thickness ratios. The composite structure combines materials with different thermal expansion properties to create a gradient that gradually transitions from the semiconductor chip to the board, reducing thermal stress concentration.
2Strength
If the insulating pattern and external pad have sufficient thickness, then stress distribution is improved, but device complexity increases
Solution Approach 1:
The patent specifies optimal thickness parameters for the insulating pattern and external pad, where the external pad thickness is 0.5 to 2.0 times the insulating pattern thickness. By optimizing these dimensional parameters, the structure achieves adequate stress distribution without excessive complexity, balancing mechanical strength and manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively minimizes cracks in external connection terminals by matching thermal expansion coefficients with external devices, improving reliability and durability of semiconductor packages.
Implementation Method 1
a difference in thermal expansion (CTE1≠CTE2, provided that CTE is an abbreviation of Coefficient of Expansion and refers to the coefficient of thermal expansion) occurs between the semiconductor package 10 and the board 20
Data Source
AI summary
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a lower structure including a semiconductor chip having a chip terminal; an external connection terminal connecting the semiconductor chip to an external device; and an intermediate connection structure including an upper surface and a lower surface opposite to the upper surface, and positioned between the lower structure and the external connection terminal.