Semiconductor Package Laminated Chip Cavity Adhesive Contamination
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor packages with laminated chip cavities face issues such as adhesive contamination, tool sticking, and sensitivity to moisture, particularly with acrylate films and prepregs, which affect the quality and flatness of the chip attachment plane.
Innovation Solution
A method involving a board and a metal foil with a layer of adhesive resin, where the adhesive resin is laminated with the board, a through opening is formed, and the metal foil is removed to expose the adhesive surface, allowing attachment to a carrier plate without adhesive overflow or flaking, enabling precise chip cavity formation at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If acrylate film or prepreg is used as adhesive layer, then adhesion is achieved, but tool sticking and particle contamination occur
Solution Approach 1:
A release film is introduced as an intermediary layer between the adhesive layer and the tools/particles. This release film prevents direct contact between the adhesive and tools, eliminating tool sticking and particle contamination while maintaining the adhesion function of the adhesive layer.
Solution Approach 2:
The release film is a thin film structure that provides the necessary functionality of preventing adhesion between the adhesive layer and external objects. This thin film approach effectively solves the tool sticking problem without compromising the underlying adhesion capability.
2Strength
If acrylate film is used as adhesive layer, then adhesion is provided, but moisture sensitivity increases adhesion to level four only
Solution Approach 1:
The adhesive system is designed as a composite structure comprising the adhesive layer combined with the release film. This composite approach allows the adhesive layer to provide strong adhesion while the release film protects against moisture sensitivity, achieving adhesion beyond level four.
3Strength
If liquid adhesive is used, then adhesion is achieved, but adhesive overflow contaminates chip cavity inwall during lamination
Solution Approach 1:
The release film acts as a flexible barrier that contains the liquid adhesive within the intended bonding area during lamination. This prevents adhesive overflow onto the chip cavity inwall while maintaining proper adhesion in the bonding region.
Solution Approach 2:
The release film serves as an intermediary barrier between the liquid adhesive and the chip cavity inwall. It allows the adhesive to perform its bonding function while preventing contamination of adjacent surfaces.
4Strength
If adhesive layer is laminated between substrates, then bonding is achieved, but flatness of chip-attached plane deteriorates
Solution Approach 1:
The release film acts as a mediator that distributes bonding stresses uniformly across the bonding interface. This uniform stress distribution prevents localized deformation and maintains the flatness of the chip-attached plane while achieving strong bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces contamination, ensures precise chip cavity depth, and improves the quality of semiconductor packages by preventing adhesive overflow and flaking, allowing for lower-cost production with better control over temperature and flatness.
Implementation Method 1
a metal foil with a layer of adhesive resin... the adhesive resin is laminated with the board
Data Source
AI summary
A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next, a through opening is formed to pass through the board, the adhesive resin and the metal foil. Next, the metal foil is removed to expose an adhesive surface of the adhesive resin on the board so as to attach a carrier plate, thereby forming a chip cavity.