Semiconductor Device Laser Exposure Resin Sealing Body

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Solution Overview

Problem

The existing methods for manufacturing semiconductor devices, which involve cutting processes to expose heat sinks and electrodes from a resin sealing body, are costly and inefficient, leading to high running costs and limited productivity.

Innovation Solution

The semiconductor device employs a laser irradiation process to expose the electrodes from the resin sealing body, eliminating the need for cutting blades and improving mass productivity by forming grooves around the electrodes within the resin body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a cutting process is used to expose heat sink and electrode from resin sealing body, then the electrodes can be exposed from the sealing body, but the running costs are high due to the price and replacement frequency of cutting blades

Engineering Contradiction:

Improveelectrode exposureVSAvoidmanufacturing cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical cutting process with a laser beam irradiation process. The laser beam ablates the resin sealing body to expose the electrodes, eliminating the need for mechanical cutting blades. This substitution resolves the contradiction by maintaining precise electrode exposure while eliminating the high running costs associated with blade replacement.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the method parameter from mechanical cutting to laser irradiation. By using laser energy to remove material instead of mechanical force, the process achieves the same electrode exposure function without the consumable blades that require frequent replacement, thereby reducing manufacturing costs while maintaining precision.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If a cutting process is used to expose heat sink and electrode from resin sealing body, then the electrodes can be exposed from the sealing body, but the mass productivity cannot be improved

Engineering Contradiction:

Improveelectrode exposureVSAvoidmass productivity

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The laser beam irradiation process enables faster material removal compared to mechanical cutting. The laser can rapidly ablate the resin sealing body without the speed limitations of mechanical blades, thereby improving mass productivity while maintaining the precision needed for electrode exposure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The laser beam can continuously irradiate and remove resin material in a streamlined process, whereas mechanical cutting requires intermittent blade changes and positioning. This continuity of useful action eliminates downtime and improves overall mass productivity while maintaining manufacturing precision.

Inventive Principle:

Principle #20Continuity of useful action

3Reliability

If grooves are formed around electrodes in the resin body, then electrode mounting stability is improved, but the device complexity increases

Engineering Contradiction:

Improveelectrode mounting stabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The grooves are formed in the resin sealing body during the laser irradiation process that also exposes the electrodes. This preliminary action of creating mounting grooves simultaneously with electrode exposure improves electrode mounting stability without requiring separate additional processing steps, thereby avoiding increased device complexity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent merges the electrode exposure function with the groove formation function into a single laser irradiation process. By combining these two functions, the device achieves improved electrode mounting stability through the grooves without adding separate structural elements or processes that would increase device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs and enhances productivity by avoiding the use of cutting tools and optimizing the exposure process, ensuring stable electrode mounting and improved efficiency in semiconductor device production.

Implementation Method 1

at least one of the first and second plate-shaped conductor portions is exposed from the sealing body by irradiating a laser on at least one surface of the sealing body

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS10811345B2Semiconductor device and method of manufacturing the same

Publication Date: 2020.10.20 RENESAS ELECTRONICS CORP

AI summary

Assembly of the semiconductor device includes the following steps: (a) mounting a semiconductor chip on the bottom electrode 40; (b) mounting the top electrode 30 on the semiconductor chip; (c) forming a sealing body 70 made of resin and provided with a convex portion 74 so as to cover the semiconductor chip; and (d) exposing the electrode surface 31 of the top electrode 30 on the top surface of the sealing body 70 and exposing the electrode surface 41 of the bottom electrode 40 on the back surface of the sealing body 70. In the step (d), at least one of the electrode surface 31 and the electrode surface 41 is exposed from the sealing body 70 by irradiating at least one of the front surface and the back surface of the sealing body 70 with the laser 110.