Semiconductor Laser Light Source with Inclined Reflecting Surface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light source devices with semiconductor lasers face challenges in airtightly enclosing the laser in a package while maintaining high reflectivity, as the formation of a light reflecting film on the upper surface of the base member interferes with bonding and can lead to reduced reflectivity due to inaccuracies in film formation.
Innovation Solution
A light source device design featuring a base member, a semiconductor laser, a lateral wall portion with an inclined reflecting surface, and a light-transmissive lid, where a dielectric film is continuously formed on both the reflecting surface and the upper surface, and a connection member is used to airtightly bond the lid, ensuring high reflectivity and airtightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light reflecting film is formed on the upper surface of the base member to improve reflectivity, then light reflectivity is improved, but bonding between the base member and lid cannot be performed appropriately
Solution Approach 1:
The base member surface is divided into two distinct regions: an inclined reflecting surface covered with a light reflecting film for high reflectivity, and a flat upper surface kept free of the reflecting film for bonding purposes. This spatial segmentation allows each surface to fulfill its specific function without interfering with the other.
Solution Approach 2:
Different surface qualities are applied to different regions of the base member. The inclined surface has a reflective quality due to the metal film coating, while the upper surface maintains a non-reflective, bondable quality. This local differentiation of surface properties enables simultaneous achievement of high reflectivity and reliable bonding.
2Reliability
If the light reflecting film is prevented from being formed on the upper surface to enable bonding, then bonding can be performed, but the position of the end portion varies depending on formation accuracy, leading to reduced reflectivity
Solution Approach 1:
The base member surface is divided into two distinct regions: an inclined reflecting surface covered with a light reflecting film for high reflectivity, and a flat upper surface kept free of the reflecting film for bonding purposes. This spatial segmentation allows each surface to fulfill its specific function without interfering with the other.
Solution Approach 2:
The light reflecting film is pre-formed to extend beyond the inclined surface onto the upper surface during the film formation process. This preliminary extension ensures complete coverage of the reflecting surface without requiring precise positioning during bonding, eliminating the problem of position variation affecting reflectivity.
3Illumination intensity
If the light reflecting film extends to the upper surface to ensure complete coverage, then reflectivity is improved, but airtight bonding between base member and lid cannot be achieved
Solution Approach 1:
The base member surface is divided into two distinct regions: an inclined reflecting surface covered with a light reflecting film for high reflectivity, and a flat upper surface kept free of the reflecting film for bonding purposes. This spatial segmentation allows each surface to fulfill its specific function without interfering with the other.
Solution Approach 2:
Different surface qualities are applied to different regions of the base member. The inclined surface has a reflective quality due to the metal film coating, while the upper surface maintains a non-reflective, bondable quality. This local differentiation of surface properties enables simultaneous achievement of high reflectivity and reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for airtight enclosure of the semiconductor laser and maintains high reflectivity by ensuring the dielectric film covers the entire reflecting surface, improving light reflectivity and bonding integrity.
Implementation Method 1
a reflecting surface which is an inside surface connected to the upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid
Data Source
AI summary
Provided is a light source device, including: a base member; a semiconductor laser disposed on the base member; a lateral wall portion formed so as to surround the semiconductor laser; a light-transmissive lid covering a gap surrounded by the base member and the lateral wall portion; and a connection member that airtightly connects an upper surface of the lateral wall portion and a lower surface of the lid over an entire perimeter of the lateral wall portion. The lateral wall portion has a reflecting surface which is an inside surface connected to an upper surface, the reflecting surface being inclined so that light emitted from the semiconductor laser is reflected toward the lid. A dielectric film is continuously formed on the reflecting surface and the upper surface. A height of the connection member is greater than a height of the dielectric film formed on the upper surface.