Semiconductor Package Lateral Grounding for EMI Shielding
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Solution Overview
Problem
The existing semiconductor device packages face challenges in reducing electromagnetic interference (EMI) while minimizing cost and size, as the conventional method of forming a shielding layer connected to a ground terminal increases packaging costs and dimensions.
Innovation Solution
A semiconductor device package design that includes a substrate with a conductive layer extending from its lateral surface to external connection elements, where the conductive layer functions as a shielding layer, reducing EMI without directly connecting to a ground layer, thereby minimizing package size and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding layer is formed on the package body and electrically connected to a ground layer, then electromagnetic interference (EMI) is reduced, but the package size and manufacturing cost increase
Solution Approach 1:
The invention extracts the ground layer from the package structure by using the substrate's lateral surface as the grounding path. The conductive layer is formed only on the package body and substrate lateral surface, eliminating the need for a separate ground layer in the substrate, thus reducing package size while maintaining EMI shielding effectiveness.
Solution Approach 2:
The invention utilizes the lateral surface dimension of the substrate to create the grounding path. Instead of using a planar ground layer on the substrate surface, the conductive path extends vertically along the lateral surface, effectively using the third dimension to solve the grounding problem without increasing the package footprint.
2Object-affected harmful factors
If a shielding layer is formed on the package body and electrically connected to a ground layer, then electromagnetic interference (EMI) is reduced, but manufacturing cost increases
Solution Approach 1:
The invention removes the requirement for a ground layer from the substrate manufacturing process. By using the substrate lateral surface as the grounding path, the manufacturing process is simplified, eliminating the need for additional ground layer deposition and connection steps, thus reducing manufacturing cost.
Solution Approach 2:
The invention merges the shielding layer function with the substrate structure by using the lateral surface as part of the grounding path. This integration eliminates the need for separate ground layer manufacturing steps, reducing process complexity and manufacturing cost while maintaining EMI shielding effectiveness.
3Volume of stationary object
If a conductive layer is formed on the package body and substrate lateral surface, then EMI is reduced without direct ground layer connection, but electrical connection reliability may be affected
Solution Approach 1:
The invention transitions the grounding path from a planar configuration to a three-dimensional configuration by utilizing the substrate lateral surface. This vertical path provides a direct and reliable electrical connection from the conductive layer to the external environment, maintaining connection reliability while reducing package size.
Data Source
AI summary
A semiconductor device package includes a substrate, a first electronic component, a first package body, an electrical contact and a first conductive layer. The substrate has a first surface, a second surface and a lateral surface extending between the first surface and the second surface. The first electronic component is disposed on the first surface of the substrate. The first package body encapsulates the first electronic component. The electrical contact is disposed on the second surface of the substrate. The first conductive layer includes a first portion and a second portion. The first portion is disposed on the first package body and the lateral surface of the substrate. The second portion contacts the electrical contact.