Semiconductor Lead Positioning Hole Slit Design
Solution Overview
Problem
Conventional semiconductor devices face challenges in precise positioning without increasing external size when fixed to an external member, as existing solutions require additional space for positioning terminals, leading to inefficiencies in assembly and potential distortion during bending processes.
Innovation Solution
A semiconductor device design featuring a first lead with a protruding portion containing a positioning hole and a slit, where the slit's center is positioned opposite to the bent portion, allowing for precise positioning without additional terminals and minimizing distortion during bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If positioning terminals are added to the semiconductor device, then positioning precision is improved, but the external size increases
Solution Approach 1:
The patent combines the positioning function with the existing lead structure by forming a positioning hole in the lead's protruding portion. This merges the positioning terminal function into the lead itself, eliminating the need for separate positioning terminals and avoiding external size increase while achieving high positioning precision through the fitting between positioning protrusion and positioning hole
Solution Approach 2:
The lead structure is designed to serve multiple functions: electrical connection, mechanical support, and positioning. The protruding portion of the lead universally performs both electrical connection and positioning functions through the positioning hole, allowing one component to fulfill multiple roles without increasing external dimensions
2Ease of manufacture
If slits are added to the lead for processing, then material extrusion is improved, but the lead structure becomes more complex
Solution Approach 1:
The lead structure is segmented into distinct functional portions: base end portion, protruding portion with positioning hole, and bent portion. The positioning hole is specifically formed in the protruding portion, creating a segmented structure that facilitates manufacturing through targeted material extrusion in specific areas without complicating the entire lead structure
Data Source
AI summary
A semiconductor device (100) comprises a main body portion (50), a semiconductor element (51), a sealing portion (60) and a first lead (10). The first lead (10) has a first base end portion (11) provided along the first direction, a protruding portion (12) protruding from the first base end portion (11) in a second direction different and having a positioning hole (13) formed therein, and a first tip end portion (17) provided in the first base end portion (11) via a bent portion (15). A slit (14) is formed in the protruding portion (12), and a positioning hole side end portion (13a) on the first base end portion (11) side of the positioning hole (13) is positioned on or more on the side opposite to the bent portion (15) than a straight line extending along the first direction from a bent-portion-side slit side end portion (14a) of the slit (14).