Semiconductor Light-Emitting Device Bonding Wall Structure
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Solution Overview
Problem
Conventional semiconductor light-emitting devices face issues with the excessive spread of bonding material, which can deteriorate the connectivity of wires connecting the semiconductor light-emitting element to the leads, leading to potential connection failures.
Innovation Solution
The semiconductor light-emitting device incorporates a configuration with a main lead, a sub lead, and a resin case that includes a wall portion to prevent the bonding material from flowing into the sub lead, ensuring secure bonding and connectivity by blocking the material's spread between the main and sub leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If bonding material is applied to bond the semiconductor light-emitting element to the main lead, then bonding strength is improved, but the bonding material spreads excessively and deteriorates wire connectivity
Solution Approach 1:
The resin case is divided into multiple functional regions including a main opening for the main lead, a sub opening for the sub lead, and a wall portion that acts as a partition. This segmentation physically separates the bonding material application area from the sub lead area, allowing bonding material to be applied generously without risking spread to the sub lead, thus maintaining both bonding strength and wire connectivity
Solution Approach 2:
The wall portion of the resin case serves as an intermediary barrier between the main lead bonding area and the sub lead. This intermediate structure prevents direct contact between the bonding material and the sub lead, enabling strong bonding at the main lead while preserving the sub lead's wire connectivity
Data Source
AI summary
There is provided a semiconductor light-emitting device including: a main lead including a main surface; a semiconductor light-emitting element mounted on the main surface of the main lead; a bonding material that bonds the semiconductor light-emitting element to the main surface of the main lead; a sub lead arranged in a first direction with respect to the main lead and including a main surface facing the same side as the main surface of the main lead; a first wire including a first end connected to the main surface of the sub lead and a second end connected to the semiconductor light-emitting element; a resin case including a case main surface facing the same direction as the main surfaces of the main lead and the sub lead and supporting the main lead and the sub lead.