Semiconductor Light Emitting Device Resin Containment

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Solution Overview

Problem

Existing light emitting devices face issues with resin out-flow and shape stabilization due to grooves extending to the end of the lead frame, leading to variance in product characteristics and quality.

Innovation Solution

A light emitting device design featuring a metal member with a concave portion and continuous depressions on its plane face, which prevents the translucent covering material from flowing out and ensures reliable placement, thereby minimizing quality variance and achieving high yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a groove for preventing resin out-flow is formed extending all the way to the end of the lead frame, then the resin flow is dammed and the semiconductor element surface is covered, but the resin may flow out from the ends of the groove and the shape is not sufficiently stabilized

Engineering Contradiction:
Improveshape stabilizationVSAvoidresin containment
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The groove is divided into a first groove portion and a second groove portion that are spatially separated and do not extend to the end of the lead frame. This segmentation prevents resin from reaching the groove ends and flowing out, while still providing effective containment through the distributed groove structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The groove is designed with different depths in different regions: the first groove portion has a greater depth than the second groove portion. This local variation in groove depth provides enhanced resin containment at critical areas while maintaining overall shape stabilization without requiring the groove to extend to the lead frame end.

Inventive Principle:
Principle #3Local quality

2Reliability

If the groove extends to the end of the lead frame to prevent resin out-flow, then resin containment is improved, but the shape stabilization becomes insufficient due to resin flowing out from groove ends

Engineering Contradiction:
Improveresin containmentVSAvoidshape stabilization
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The groove structure is segmented into multiple portions (first groove portion and second groove portion) with different depths, creating a distributed containment system that prevents resin from reaching the lead frame ends while maintaining effective shape stabilization.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the groove have different depths (first groove portion deeper than second groove portion), providing localized enhanced containment where needed while achieving overall shape stabilization without extending to the lead frame end.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP1898474B1Semiconductor light emitting device
Publication Date: 2016.11.09 NICHIA CORP
  • EP1898474B1 patent drawingFigure 1
  • EP1898474B1 patent drawingFigure 2a~2b
  • EP1898474B1 patent drawingFigure 3a~3b

AI summary

A light emitting device comprises a first metal member, a light emitting element mounted at one end of the first metal member, and a translucent covering material that covers at least the light emitting element, wherein the surface of the first metal member has a depression that determines the region where the translucent covering material is formed, and the inner wall of the depression is continuous.