Semiconductor Light Emitting Device With Reflective Side Wall Electrodes
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Solution Overview
Problem
Conventional semiconductor light emitting devices face challenges in achieving efficient light emission and reliable electrical connections, particularly in packaging and wire-free mounting, which limits their directional light emission and application in various fields.
Innovation Solution
The semiconductor light emitting device incorporates reflective electrode layers and passivation layers with openings to enhance light extraction and electrical reliability, allowing for wire-free mounting and packaging through four side surfaces or a 360° angle, utilizing compound semiconductor layers and conductive support members for improved structural integrity and light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional packaging methods are used with wire connections, then electrical connections can be established, but the device complexity increases and mounting versatility is limited
Solution Approach 1:
The patent removes the wire connection component from the packaging structure, allowing chips to be directly die-bonded to the electrode layers on the side walls. This extraction of the wire eliminates the need for additional connection components, reducing device complexity while enabling wire-free mounting configurations.
Solution Approach 2:
The electrode layers are designed to serve multiple functions: they provide electrical connections, act as reflective surfaces for light extraction, and serve as bonding surfaces for die-bonding chips. This multi-functionality eliminates the need for separate wire connections and enables versatile mounting options including side wall bonding and 360° packaging.
2Loss of energy
If light emitting structures are used without reflective electrode layers, then device structure is simpler, but light extraction efficiency is reduced
Solution Approach 1:
The patent converts the normally harmful reflective property (which would trap light) into a beneficial feature by positioning reflective electrode layers on the side walls and bottom surface. These surfaces reflect light that would otherwise be lost back into the light emitting structure, improving extraction efficiency while the top surface remains open for light emission.
Solution Approach 2:
The patent moves the reflective electrode layers from the conventional top-bottom plane to the side wall vertical dimension. This dimensional change allows light to be reflected from multiple directions (side walls and bottom) back into the active region, enhancing light extraction efficiency without blocking the primary light emission path.
3Device complexity
If wire-free mounting is implemented, then device complexity is reduced, but electrical connection reliability may be compromised
Solution Approach 1:
The patent merges the electrical connection function with the mechanical bonding function by integrating the electrode layers into the die-bonding structure. The same electrode layers that provide electrical connectivity also serve as the bonding surface for attaching chips, eliminating the need for separate wire connections and ensuring reliable electrical contact through direct metal-to-semiconductor bonding.
4Adaptability or versatility
If conventional top-emission configuration is used, then light emission is simpler, but directional light emission limits application versatility
Solution Approach 1:
The patent transitions from a single-direction (top-emission) light output to multi-directional light emission by adding reflective surfaces on the side walls and bottom. This enables light to be extracted from the top, side walls, and bottom simultaneously, creating versatile lighting configurations for various applications without requiring multiple separate emitters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient light emission in all directions, enhances electrical reliability, and allows for versatile packaging options, suitable for applications in illumination, indicators, and displays without the need for wires, thereby improving light efficiency and device performance.
Implementation Method 1
reflective electrode layers provided on/under a light emitting structure
Data Source
AI summary
Disclosed are a semiconductor light emitting device. The semiconductor light emitting device comprises a light emitting structure comprising a plurality of compound semiconductor layers, a passivation layer at the outside of the light emitting structure, a first electrode layer on the light emitting structure, and a second electrode layer under the light emitting structure.