Semiconductor Device Lens Focal Point Placement
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Solution Overview
Problem
High-resolution micro-displays and imaging devices face challenges in achieving high brightness, high resolution, and full color due to difficulties in accurately mounting micro-LEDs and forming monolithic structures, especially in devices smaller than 1 inch, where conventional techniques like flip-chip mounting and wafer bonding struggle with accuracy and color reproduction.
Innovation Solution
A semiconductor device is designed with a lens member that includes multiple optical semiconductor elements, where the first and second optical semiconductor elements are positioned between the lens member and its focal point, overlapping in the optical axis direction, with the second element closer to the focal point, to enhance light collection efficiency and compensate for differences in luminous efficiencies among the elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional flip-chip mounting is used to mount micro-LEDs, then the device can be assembled, but mounting accuracy is insufficient for micro-displays smaller than 1 inch
Solution Approach 1:
The patent replaces the mechanical flip-chip mounting process with a wafer bonding approach, where multiple layers of optical semiconductor elements are bonded together in a monolithic structure. This eliminates the need for individual micro-LED mounting operations and achieves the required sub-1-inch display precision through wafer-level processing accuracy.
Solution Approach 2:
The patent merges multiple optical semiconductor elements into a single monolithic structure through wafer bonding. By combining the mounting process with the structural formation process, the patent achieves both high precision and full-color capability in a unified device architecture.
2Manufacturing precision
If wafer bonding is used to form a monolithic structure, then processing accuracy is high, but full color reproduction becomes difficult to achieve
Solution Approach 1:
The patent segments the optical semiconductor elements into multiple layers, with each layer containing elements of a specific color (red, green, blue). This layered segmentation allows each layer to be optimized for its specific wavelength while maintaining the benefits of wafer bonding for precise alignment and monolithic integration.
Solution Approach 2:
The patent uses composite material structures in the optical semiconductor elements, with different semiconductor materials optimized for different color emissions. The wafer bonding process joins these composite material layers while maintaining their individual optical properties, enabling full-color reproduction with high processing accuracy.
3Productivity
If optical semiconductor elements with different luminous efficiencies are used, then device performance varies, but consistency in light output becomes difficult to achieve
Solution Approach 1:
The patent applies local quality optimization by positioning optical semiconductor elements with different luminous efficiencies at different distances from the lens focal point. Elements with lower luminous efficiency are positioned closer to the focal point to receive more concentrated light, while elements with higher efficiency are positioned farther away, creating a compensated distribution that achieves consistent overall light output across all color elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light collection efficiency and compensates for the low luminous efficiency of certain elements, effectively producing high-quality color images by optimizing the placement of light emitting or receiving elements relative to the lens, enhancing the overall performance of micro-displays and imaging devices.
Implementation Method 1
a lens member, wherein the first optical semiconductor element and the second optical semiconductor element are disposed between the lens member and a focal point of the lens member
Data Source
AI summary
A semiconductor device includes: a first layer including a first optical semiconductor element; a second layer including a second optical semiconductor element having a lower conversion efficiency than the first optical semiconductor element; and a lens member. The first optical semiconductor element and the second optical semiconductor element are disposed between the lens member and a focal point of the lens member in an optical axis direction of the lens member, at least partially overlap as viewed in the optical axis direction, and are disposed so that the second optical semiconductor element is closer to the focal point than the first optical semiconductor element.