Semiconductor Package Lid Cavity Rigidity
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Solution Overview
Problem
The challenge is to reduce the thickness of semiconductor device substrates without compromising their rigidity, as thinner substrates tend to warp and lose structural integrity, which is undesirable in MEMS devices.
Innovation Solution
A semiconductor device package design that includes a redistribution layer structure, a lid, and an encapsulant, where the lid defines a cavity with the redistribution layer and is surrounded by the encapsulant, enhancing the package's rigidity and allowing for thinner substrates without increased warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the substrate is reduced to make the semiconductor device package smaller, then the size of the package is reduced, but the rigidity of the substrate deteriorates causing warpage
Solution Approach 1:
The patent employs a composite structure consisting of the substrate, redistribution layer structure, lid, and encapsulant. This composite construction provides enhanced rigidity and structural support, allowing the substrate itself to be made thinner without compromising overall package strength. The combination of multiple materials and structural elements compensates for the reduced substrate thickness.
Solution Approach 2:
The patent introduces a three-dimensional packaging structure with vertical stacking of components (substrate, redistribution layers, lid, encapsulant). By utilizing the vertical dimension, the package achieves compact size in the horizontal plane while maintaining structural integrity through the vertical arrangement of supporting elements.
2Length of stationary object
If the thickness of the substrate is reduced, then the package can be made thinner, but warpage increases due to deteriorated rigidity
Solution Approach 1:
The multi-layer composite structure (substrate + redistribution layer structure + lid + encapsulant) provides distributed structural support that prevents warpage. Each layer contributes to the overall mechanical stability, allowing thin substrate design without warpage issues.
Solution Approach 2:
The patent divides the package into segmented functional layers (substrate, redistribution layer structure, lid, encapsulant), where each segment provides specific structural support. This segmentation distributes mechanical stresses and prevents warpage that would occur in a monolithic thin structure.
Data Source
AI summary
A semiconductor device package includes a redistribution layer structure, a lid, a sensing component and an encapsulant. The lid is disposed on the redistribution layer structure and defines a cavity together with the redistribution layer structure. The sensing component is disposed in the cavity. The encapsulant surrounds the lid.