Spring-Supported Semiconductor Lid Structure for CTE Mismatch
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Solution Overview
Problem
Semiconductor packages face issues with warpage due to coefficient of thermal expansion (CTE) mismatch, leading to poor thermal coupling and potential delamination between the package and the lid structure, which affects reliability and heat dissipation efficiency.
Innovation Solution
Incorporation of a lid structure with a fluid chamber and spring members, along with a ring structure, to accommodate CTE mismatch and enhance thermal coupling, using materials with varying stiffness and incorporating fin structures for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid lid structure is used to provide structural support, then structural strength is improved, but thermal coupling deteriorates due to CTE mismatch causing warpage and delamination
Solution Approach 1:
The patent transforms the rigid, static lid structure into a dynamic system by incorporating spring members that can elastically deform. This allows the lid to adapt its shape dynamically in response to thermal expansion and contraction, maintaining continuous contact with the package structure and preventing delamination while preserving structural support.
Solution Approach 2:
The patent changes the physical parameters of the lid structure by introducing elements with different mechanical properties (spring members with varying stiffness) and geometric configurations (fin structures). These parameter changes enable the lid to accommodate CTE mismatch through elastic deformation while maintaining thermal coupling.
2Reliability
If spring members are added to accommodate CTE mismatch, then thermal coupling is improved, but device complexity increases
Solution Approach 1:
The patent employs flexible spring members that act as elastic elements between the lid and package structure. These spring members provide the necessary compliance to accommodate CTE mismatch while maintaining a relatively simple overall structure, avoiding the need for complex active control systems or multiple adjustment mechanisms.
3Loss of energy
If fin structures are incorporated to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent adds fin structures that extend in the vertical dimension, increasing the surface area available for heat dissipation without significantly expanding the horizontal footprint. This dimensional approach improves heat dissipation efficiency while maintaining a compact package design and avoiding excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal coupling and reduces warpage, enhancing the reliability and heat dissipation efficiency of semiconductor packages by accommodating CTE mismatch and providing a robust structural framework.
Implementation Method 1
a lid structure (190) bonded over the package structure and thermally coupled to the semiconductor die, wherein the lid structure includes a plurality of spring members (196)
Implementation Method 2
wherein the lid structure is in contact with the thermal interface material
Data Source
AI summary
A semiconductor package includes a substrate, a package structure, and a lid structure. The package structure is bonded over the substrate. The lid structure is bonded over the substrate and thermally coupled to the package structure, wherein the lid structure includes a fluid chamber and a plurality of spring members disposed in the fluid chamber, wherein each of the plurality of spring members is connected between an upper plate and a lower plate of the fluid chamber.