Semiconductor Package Lid Venting for Moisture Discharge
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Solution Overview
Problem
Existing semiconductor apparatuses face issues with insufficient discharge of moisture and/or gas due to small opening areas in air-permeable portions, which leads to dew condensation and moisture intrusion, affecting semiconductor performance.
Innovation Solution
The semiconductor apparatus incorporates a lid or side wall with penetrating portions that penetrate through the lid or side wall to form a hollow structure, allowing for increased discharge of moisture and/or gas through larger opening areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hollow structure package is used with a lid bonded to the substrate, then the package structure is formed, but the opening area of the air-permeable portion is small leading to insufficient discharge of moisture and gas
Solution Approach 1:
The lid is divided into multiple regions: a bonded portion that bonds to the substrate, a non-bonded portion that forms the air-permeable opening, and a protrusion that extends toward the semiconductor chip. This segmentation allows the lid to simultaneously provide structural support through bonding while creating sufficient opening area for moisture and gas discharge in the non-bonded region.
Solution Approach 2:
The protrusion extends in the height direction (third dimension) from the lid toward the semiconductor chip. This dimensional extension increases the effective opening area for air permeability without compromising the horizontal bonding area, thereby resolving the contradiction between maintaining package integrity and ensuring sufficient moisture discharge capability.
2Strength
If mold package with resin is used to cover the semiconductor chip, then the chip is protected, but airtightness is not maintained allowing moisture and gas intrusion
Solution Approach 1:
The protrusion is formed in advance during package fabrication to create a predetermined air-permeable path through the resin. This preliminary structural feature ensures that moisture and gas can be discharged before they reach the semiconductor chip, preventing reliability issues while maintaining the protective function of the mold package.
Solution Approach 2:
The protrusion acts as an intermediary structure that creates a controlled air-permeable channel through the resin. This intermediary feature allows selective permeability - protecting the chip from direct moisture contact while providing a designated path for moisture and gas discharge, thus resolving the contradiction between protection and moisture resistance.
3Ease of manufacture
If adhesive and resin are used in package fabrication, then the components are bonded and protected, but moisture and gas are introduced into the package
Solution Approach 1:
The protrusion structure extracts or removes a portion of the resin in the air-permeable region, creating a dedicated discharge path. This extracted region allows moisture and gas introduced during manufacturing with adhesives and resins to be discharged outward, preventing accumulation and subsequent harm to the semiconductor chip while maintaining the bonding functionality of the materials.
Data Source
AI summary
A semiconductor apparatus includes a substrate (12), a semiconductor chip (14) disposed on the substrate (12), a side wall (16) disposed on the substrate (12) and surrounding the semiconductor chip (14), and a lid (18) disposed on the side wall (16) and above the semiconductor chip (14) to form a hollow structure (22) together with the substrate (12), the semiconductor chip (14), and the side wall (16), the lid (18) including a penetrating portion (20) penetrating through the lid (18) to the interior of the hollow structure (22).