Semiconductor Light Emitting Device Mounting via Dielectric Guide
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Solution Overview
Problem
The challenge in manufacturing semiconductor light emitting devices is to enhance light extraction efficiency while maintaining high precision and speed in the mounting process, particularly for flip-chip semiconductor light emitting devices, where the existing technologies face limitations in achieving both high light extraction efficiency and cost competitiveness due to low mounting precision and long mounting times.
Innovation Solution
A method involving a semiconductor light emitting device with a stacked structure unit, including a light emitting layer between semiconductor layers, and dielectric stacked films with different refractive indexes on the electrodes, which are used as positioning guides for high-precision assembly, allowing for increased reflecting surface area and efficient light extraction by using protruding portions to guide connection members during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the surface area of the reflecting region is increased to improve light extraction efficiency, then light extraction efficiency is improved, but mounting precision requirements increase and mounting time increases
Solution Approach 1:
The patent introduces a protruding portion on the dielectric film as an intermediary positioning guide structure. This protruding portion physically guides the connection member during mounting, acting as a mediator between the electrode and the mounting process. By providing this intermediate guiding structure, the system achieves high mounting precision without requiring extremely tight tolerances on the electrode alignment, thus resolving the contradiction between improving light extraction efficiency (larger electrode area) and maintaining mounting precision.
2Ease of manufacture
If the surface area of the reflecting region is increased to improve light extraction efficiency, then light extraction efficiency is improved, but mounting time increases
Solution Approach 1:
The protruding portion serves as a positioning guide that enables automated mounting equipment to quickly and accurately position connection members. This intermediary structure reduces the time required for alignment and mounting operations, allowing mass production to achieve mounting times of 0.5 seconds or less even with increased electrode surface areas for improved light extraction efficiency.
3Ease of manufacture
If electrode design emphasizes light extraction efficiency, then light extraction efficiency is improved, but mounting precision is compromised
Solution Approach 1:
The patent segments the electrode structure by separating the functional electrode (for electrical connection and light reflection) from the positioning function. The protruding portion on the dielectric film is specifically dedicated to positioning, while the electrode itself is optimized for light extraction efficiency. This segmentation allows each component to be optimized independently without compromising the other.
Solution Approach 2:
The protruding portion acts as an intermediary positioning structure that decouples the mounting precision requirements from the electrode design. By providing this separate positioning element, the electrode can be designed with larger surface area for improved light extraction without being constrained by tight mounting tolerance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-precision and high-speed assembly of semiconductor light emitting devices with improved light extraction efficiency and cost-effectiveness by increasing the reflecting surface area and reducing mounting time, while maintaining high alignment precision and preventing stress and voids between connection members and semiconductor layers.
Implementation Method 1
light extraction efficiency can be improved by improving the reflectance and increasing the surface area of the reflecting region
Implementation Method 2
dielectric stacked film... formed of stacked dielectric films having different refractive indexes
Data Source
AI summary
A method for manufacturing a semiconductor light emitting apparatus having first semiconductor layer and second semiconductor layer sandwiching a light emitting layer, first and second electrodes provided on respective major surfaces of the first semiconductor and second semiconductor layers to connect thereto, stacked dielectric films having different refractive indexes provided on portions of the major surfaces not covered by the first and second electrodes, and a protruding portion erected on at least a portion of a rim of at least one of the first and second electrodes. The mounting member includes a connection member connected to at least one of the first and second electrodes. The method includes causing the semiconductor light emitting device and a mounting member to face each other, and causing the connection member to contact and join to the at least one of the first and second electrodes using the protruding portion as a guide.