Semiconductor Light Emitting Device Packages With Convex Encapsulation
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Solution Overview
Problem
Current semiconductor light emitting device packages face challenges in enhancing light extraction efficiency and reliability, particularly as applications expand to larger and more efficient lighting devices.
Innovation Solution
A semiconductor light emitting device package design featuring a substrate with a semiconductor light emitting device and an encapsulation layer that includes ring portions and a center portion with convex parts, which protrude from the substrate, increasing light extraction efficiency by reducing total reflection and acting as a convex lens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional flat encapsulation layer is used, then the device structure is simple and easy to manufacture, but light extraction efficiency is low due to total internal reflection
Solution Approach 1:
The encapsulation layer is designed with convex portions that protrude from the substrate surface, creating curved interfaces instead of flat surfaces. These convex portions have different radii of curvature in different directions, forming an asymmetric lens-like structure that refracts and extracts light more effectively by reducing total internal reflection at the interface.
Solution Approach 2:
The encapsulation layer features localized convex portions with specific curvature characteristics at different locations, rather than a uniform structure. The varying radii of curvature in different directions create localized optical properties that optimize light extraction from the semiconductor light emitting device while maintaining overall structural integrity.
2Loss of energy
If the encapsulation layer has convex portions with varying curvature, then light extraction efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The invention optimizes specific geometric parameters of the convex portions, including the first and second radii of curvature, height, and width ratios. By establishing specific parameter ranges (e.g., 0.5 ≤ first radius of curvature < 2.0 μm, 2.0 ≤ second radius of curvature < 5.0 μm), the design achieves effective light extraction while maintaining manufacturability through controlled parameter variations rather than complex geometric forms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package design significantly enhances light extraction efficiency by attenuating total reflection and increasing the beam angle of emitted light, making it suitable for various lighting applications.
Implementation Method 1
The encapsulation layer may include convex parts which convexly protrude in a direction away from the substrate. The convex parts may include vertices constituting concentric circles, in plan view.
Implementation Method 2
an encapsulation layer which covers the semiconductor light emitting device. The encapsulation layer may include: a plurality of ring portions disposed sequentially from an edge toward a center of the substrate, in plan view; and a center portion surrounded by an innermost one of the plurality of ring portions.
Data Source
AI summary
Provided is a semiconductor light emitting device package. The semiconductor light emitting device package includes a substrate, a semiconductor light emitting device on the substrate, and an encapsulation layer which covers the semiconductor light emitting device. The encapsulation layer includes a plurality of ring portions which are disposed sequentially from an edge toward a center of the substrate in plan view, and a center portion which is surrounded by an innermost one of the plurality of ring portions.