Semiconductor Light Emitting Device Recess Reflective Resin
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Solution Overview
Problem
Semiconductor light emitting devices experience a decrease in optical output over time due to increased light emission, leading to reduced reflectivity and potential peeling of components in surface mount devices.
Innovation Solution
A semiconductor light emitting device design featuring a recess with a step on its side wall, a reflective filler-containing resin layer covering the inner surface with higher reflectivity than the recess, and a sealing resin to enclose the element, which reduces optical energy absorption and enhances light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a semiconductor light emitting device increases its optical output, then the light emission performance is improved, but the reflectivity decreases and peeling occurs over time
Solution Approach 1:
The patent applies a reflective resin layer selectively to specific inner surfaces of the molded body recess where light reflection is most beneficial. This localized application maintains high reflectivity in critical areas without requiring the entire device to use reflective materials, thus preserving optical output while preventing reflectivity degradation over time.
Solution Approach 2:
The patent uses a composite structure combining the molded body material with a reflective resin layer containing reflective particles or coating. This composite approach enhances the overall reflectivity of the device interior, allowing sustained high optical output performance without the peeling and reflectivity loss that occur in conventional single-material constructions.
2Power
If a semiconductor light emitting device increases its optical output, then the light emission performance is improved, but peeling of components occurs
Solution Approach 1:
The reflective resin layer is applied selectively to specific inner surfaces of the recess, creating localized zones of enhanced reflectivity. This localized application reduces overall stress distribution and prevents peeling at critical interfaces while maintaining high optical output performance.
Solution Approach 2:
The composite structure of the reflective resin layer bonded to the molded body creates a more robust interface that resists peeling. The layered composite design distributes mechanical stress more effectively, preventing component separation even under high optical output conditions.
3Power
If a reflective resin layer is added to increase light extraction efficiency, then optical performance is improved, but device complexity increases
Solution Approach 1:
The reflective resin layer is integrated directly into the molded body recess structure, combining the reflective function with the existing packaging geometry. This merging approach enhances light extraction efficiency without requiring separate reflective components or complex additional structures.
Solution Approach 2:
The reflective resin layer serves multiple functions simultaneously: it enhances light extraction efficiency, maintains reflectivity over time, and provides a bonding interface that prevents peeling. This multi-functionality achieves improved optical performance without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution extends the operating life of semiconductor light emitting devices by maintaining high residual brightness and preventing peeling, while simplifying the process by using a common reflective filler-containing resin layer for both thermoplastic resin and inner lead, thereby increasing light extraction efficiency and reliability.
Implementation Method 1
a resin layer covering at least a portion of an inner surface of the recess of the body and having a higher reflectivity than the inner surface of the recess of the body
Data Source
AI summary
A semiconductor light emitting device includes: a body having a recess, a step being provided on a side wall of the recess; a semiconductor light emitting element mounted in the recess; and a resin layer. The resin layer covers at least a portion of an inner surface of the recess of the body. The resin layer has a higher reflectivity than the inner surface of the recess of the body.