Semiconductor Light Emitting Device Rounded Sealing Member
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Solution Overview
Problem
Conventional semiconductor light emitting device manufacturing methods often result in cracks in the passivation film due to stress concentration at the corners of the sealing member, leading to reduced reliability and environmental shielding properties.
Innovation Solution
The semiconductor light emitting device design features a sealing member with rounded corners of its protruding portion, which reduces stress concentration on the passivation film, and an interconnect layer that extends onto the electrodes with the passivation film interposed, enhancing light reflection and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sealing member has sharp corners, then the manufacturing process is simpler, but stress concentration occurs at the corners causing cracks in the passivation film
Solution Approach 1:
The sealing member's protruding portion is designed with a rounded corner (curved shape) instead of a sharp corner. This curvature eliminates stress concentration points at the corners, preventing cracks in the passivation film while maintaining manufacturing feasibility through standard molding processes
2Object-affected harmful factors
If the sealing member covers the electrode completely, then environmental shielding is improved, but light output is reduced due to heat absorption and light blocking
Solution Approach 1:
The sealing member is designed with a protruding portion that locally covers only the peripheral region of the electrode, while leaving the central region exposed. This localized coverage provides environmental shielding at the edges where it is most needed, while maintaining light emission from the central area
Solution Approach 2:
The sealing member extends in the vertical dimension with a protruding portion that covers the electrode periphery, creating a three-dimensional structure that provides shielding without completely blocking the light path from the semiconductor layer
3Illumination intensity
If the interconnect layer extends onto the electrode, then light reflection is enhanced, but heat dissipation path is reduced
Solution Approach 1:
The interconnect layer is positioned to extend onto only the peripheral region of the electrode where the sealing member protrudes, rather than covering the entire electrode surface. This localized extension provides light reflection enhancement at the edges while leaving the central electrode region available for heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the reliability of the semiconductor light emitting device by reducing crack occurrence in the passivation film and increasing light output by effectively utilizing light and reducing heat absorption, while maintaining structural integrity.
Implementation Method 1
an insulating film provided between the semiconductor layer and the sealing member and between the fluorescer layer and the sealing member
Implementation Method 2
enhancing light reflection and heat dissipation
Implementation Method 3
a sealing member configured to cover a lower surface and a side surface of a structural body made of the semiconductor layer and the electrode
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
According to one embodiment, a semiconductor light emitting device (1) includes a semiconductor layer (10), a sealing member (12) configured to cover a lower surface of the semiconductor layer (10) and a side surface of the semiconductor layer (10) to protrude to be higher than an upper surface (10a) of the semiconductor layer (10) at a side of the semiconductor layer (10), a fluorescer layer (18) provided above the semiconductor layer (10) and the sealing member (12), and an insulating film (19) provided between the sealing member (12) and the semiconductor layer (10) and between the sealing member (12) and the fluorescer layer (18). A corner (12b) of a protruding portion (12a) of the sealing member (12) is rounded.