Semiconductor Light-Emitting Device Sealing Structure
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Solution Overview
Problem
Semiconductor light-emitting devices face issues with the semiconductor light-emitting element coming off the mounting substrate due to stress, which existing technologies attempt to mitigate through stress reduction treatments.
Innovation Solution
A semiconductor light-emitting device configuration featuring a semiconductor light-emitting element with a supporting substrate and a sealing member, where the sealing part integrally covers the supporting substrate and the side surface of the sealing member, providing a secure seal without requiring stress reduction treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stress reduction treatment is performed to prevent light-emitting element detachment, then reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The sealing part is designed with a structure that preliminarily prevents stress-induced detachment before stress reduction treatment is needed. The sealing part integrally covering the supporting substrate and sealing member side surface creates a pre-reinforced structure that resists stress during assembly, eliminating the need for subsequent stress reduction processes.
Solution Approach 2:
The invention extracts and eliminates the stress reduction treatment step from the manufacturing process by using a sealing part structure that inherently prevents stress-related problems. This removes the need for heat treatment or other stress reduction processes while maintaining reliability.
2Reliability
If stress reduction treatment is performed to prevent light-emitting element detachment, then reliability is improved, but manufacturing time and cost increase
Solution Approach 1:
The sealing part structure is designed in advance to prevent stress-induced detachment during assembly. By incorporating the sealing part that integrally covers the supporting substrate and sealing member side surface, the structure preliminarily addresses stress issues, eliminating the need for time-consuming heat treatment or stress reduction processes.
Solution Approach 2:
The invention skips the stress reduction treatment step entirely by using a sealing part structure that inherently prevents stress-related detachment. This allows the manufacturing process to proceed directly from assembly to completion without intermediate stress reduction steps, reducing manufacturing cycle time.
3Reliability
If a sealing part integrally covering supporting substrate and sealing member is used, then light-emitting element detachment is prevented, but device structure becomes more complex
Solution Approach 1:
The sealing part merges the functions of covering the supporting substrate and covering the sealing member side surface into a single integrated component. This unified sealing part simultaneously performs multiple sealing and protective functions, preventing light-emitting element detachment while maintaining structural simplicity.
Solution Approach 2:
The sealing part is designed as a multi-functional component that provides mechanical support, stress distribution, and sealing protection simultaneously. By making the sealing part universal in its functionality, the structure achieves enhanced reliability without proportionally increasing complexity.
Data Source
AI summary
A semiconductor light-emitting device includes a semiconductor light-emitting element having a supporting substrate and a sealing member located above the supporting substrate, a mounting substrate on which the semiconductor light-emitting element is mounted in such a manner that the sealing member faces the mounting substrate, and a sealing part that integrally covers a part of the supporting substrate and a side surface of the sealing member and seals the semiconductor light-emitting element and the mounting substrate.