Semiconductor Light-Emitting Device Wiring Substrate Sealing
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Solution Overview
Problem
The existing semiconductor light-emitting device configurations face challenges in sealing the gap between the cap and substrate due to large cross-sectional area wiring, which complicates the configuration and increases costs, while also requiring high current supply to enhance optical output.
Innovation Solution
A semiconductor light-emitting device with a wiring substrate featuring a first and second metal layer spaced apart by a spacer layer, where the cap unit is bonded to the wiring substrate, allowing for efficient sealing and reduced complexity, using a cap unit with a light-transmissive window and antireflection film for light extraction and a heat sink for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a wiring having a large cross-sectional area is disposed above the substrate to supply large current, then the optical output is improved, but a gap is created between the cap and substrate making it difficult to seal
Solution Approach 1:
The patent transitions from planar wiring layout to three-dimensional stacked wiring layers. Multiple wiring layers (first wiring layer, second wiring layer, third wiring layer) are arranged vertically above the substrate, allowing sufficient current-carrying cross-sectional area while maintaining a compact footprint that enables proper cap sealing.
2Power
If a wiring having a large cross-sectional area is disposed above the substrate, then the current supply capability is improved, but the configuration becomes complicated and costs increase
Solution Approach 1:
The wiring structure is segmented into multiple independent wiring layers (first, second, and third wiring layers) with distinct functions. The first wiring layer provides current supply, the second wiring layer provides return path, and the third wiring layer provides additional current supply. This segmentation allows each layer to be optimized independently while collectively achieving high current capability without excessive complexity.
3Reliability
If the cap hermetically seals the semiconductor light-emitting element, then the reliability is improved, but heat dissipation becomes challenging
Solution Approach 1:
A heat dissipation structure is introduced as an intermediary component between the semiconductor light-emitting element and the external environment. This structure provides a thermal conduction path for heat removal while being positioned within the hermetically sealed cavity, thus maintaining both sealing integrity and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a simplified configuration with increased optical output and enhanced reliability by effectively sealing the gap and managing heat, allowing for efficient light emission and reduced operational voltage.
Implementation Method 1
a cap unit which is disposed above the upper surface of the wiring substrate and covers the semiconductor light-emitting element... the bonding surface which is bonded to the wiring substrate
Implementation Method 2
a heat sink for thermal management
Implementation Method 3
a transparent plate for extracting out laser light is provided on a side surface of the cap
Data Source
AI summary
A semiconductor light-emitting device is provided which includes: a wiring substrate; a semiconductor light-emitting element disposed above an upper surface of the wiring substrate; and a cap unit which covers the semiconductor light-emitting element. The wiring substrate includes: a first substrate; a first metal layer and a second metal layer that are spaced apart from each other above the first substrate; and a spacer layer disposed above the first substrate. The cap unit includes a bonding surface which is bonded to the wiring substrate. The bonding surface intersects the first metal layer and the second metal layer in a top view of the wiring substrate, and the spacer layer is disposed between the bonding surface and the first substrate, at a position different from positions of the first metal layer and the second metal layer.