Semiconductor Light-Emitting Element Ag Migration Barrier

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Solution Overview

Problem

Semiconductor light-emitting elements with reflective metal layers, such as those containing Ag, suffer from Ag migration issues that degrade the reliability and light extraction efficiency due to the metal's propensity to migrate and react with other layers.

Innovation Solution

A semiconductor light-emitting element structure featuring an ohmic electrode layer, a reflective metal layer containing Ag that covers at least the ends of the ohmic electrode layer, and a covering electrode layer made of conductive oxide films to reliably bury and protect the reflective metal layer, preventing Ag migration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a reflective metal layer containing Ag is formed on the p-type semiconductor layer to improve light extraction efficiency, then light extraction efficiency is improved, but Ag migration occurs which degrades reliability

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidelement reliability
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

An Al layer is introduced as an intermediary barrier layer between the Ag reflective metal layer and the p-type semiconductor layer. This Al layer prevents Ag atoms from migrating into the semiconductor layer while maintaining the light-reflecting function of the Ag layer, thus resolving the contradiction between light extraction efficiency and reliability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electrode structure is designed as a composite multi-layer system comprising Ag layer, Al layer, and p-type semiconductor layer. The combination of different materials (Ag for reflectivity, Al for barrier properties) creates a structure that simultaneously achieves high light extraction efficiency and prevents Ag migration, resolving the reliability issue

Inventive Principle:
Principle #40Composite materials

2Illumination intensity

If Ag is used as reflective metal to achieve high light reflectivity, then light extraction efficiency is improved, but Ag easily migrates to other layers causing degradation in electric properties

Engineering Contradiction:
Improvelight reflectivityVSAvoidAg migration
Core Design Contradiction:
Illumination intensityVSObject-generated harmful factors

Solution Approach 1:

The Al layer serves as a mediator that blocks the migration path of Ag atoms while allowing the Ag layer to maintain its light-reflecting function. This intermediary barrier prevents the harmful Ag migration effect without compromising the beneficial light reflectivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The Al barrier layer is placed in advance between the Ag layer and semiconductor layer to preemptively prevent Ag migration before it can occur. This preliminary protective action stops the harmful migration process at its source, maintaining both reflectivity and electrical properties

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the reliability and light extraction efficiency by preventing Ag migration and ensuring stable electrical properties while maintaining high light reflection and emission uniformity.

Implementation Method 1

a reflective metal layer containing Ag is formed so as to cover at least ends of the ohmic electrode layer

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS9136438B2Semiconductor light-emitting element
Publication Date: 2015.09.15 STANLEY ELECTRIC CO LTD
  • US9136438B2 patent drawing
  • US9136438B2 patent drawing
  • US9136438B2 patent drawing

AI summary

A semiconductor light-emitting element includes: an ohmic electrode layer formed on a surface of a semiconductor structure layer including a light-emitting layer; a reflective metal layer containing Ag formed so as to cover at least ends of the ohmic electrode layer; and a covering electrode layer formed so as to bury the reflective metal layer.