Semiconductor Light-Emitting Element Assembly Heat Dissipation
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Solution Overview
Problem
Conventional semiconductor light-emitting elements face inefficiencies in heat dissipation, leading to reduced luminous efficiency and shortened lifespan due to inadequate heat management.
Innovation Solution
A semiconductor light-emitting element assembly is designed with a metal body for heat dissipation fixed to the leads via an insulating adhesive layer, a heat dissipator attached to the wiring board, and an interval holding part to prevent deformation, enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structure is added to semiconductor light-emitting element assembly, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation function is segmented into multiple components: metal body for heat dissipation, heat dissipator, and interval holding part. This segmentation allows each component to perform its specific function efficiently while maintaining overall system manageability and reducing complexity through functional decomposition.
Solution Approach 2:
The metal body for heat dissipation serves multiple functions: it acts as a heat dissipation component, provides structural support, and serves as a mounting base for the heat dissipator. This multi-functionality reduces the need for additional separate components, thereby improving heat dissipation performance without proportionally increasing device complexity.
2Temperature
If heat dissipator size is increased to improve heat dissipation, then heat dissipation performance is improved, but device size increases
Solution Approach 1:
The heat dissipator extends in the vertical direction (upward from the metal body) rather than only in the horizontal plane. This dimensional change allows the heat dissipation surface area to be increased without proportionally increasing the footprint area on the wiring board, thus improving heat dissipation performance while controlling device size.
3Temperature
If heat dissipator is fastened tightly to wiring board, then heat dissipation performance is improved, but wiring board deformation occurs
Solution Approach 1:
The interval holding part is installed beforehand between the heat dissipator and wiring board to prevent excessive contact pressure. This prior cushioning measure ensures that the heat dissipator is securely fastened for effective heat dissipation while simultaneously preventing wiring board deformation by limiting the fastening pressure to an appropriate level.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation by promptly spreading and releasing heat from the semiconductor chip, preventing accumulation and deformation, thus enhancing the assembly's thermal management and longevity.
Implementation Method 1
heat conducted from the semiconductor light-emitting element chip to the first lead passes via the insulating adhesive layer to the metal body for heat dissipation. The heat is promptly spread over the metal body for heat dissipation and released to the outside
Implementation Method 2
a reflector fixed to the first and second leads and reflecting light from the chip
Data Source
AI summary
A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.