An ESD protection structure uses an isolation trench and epitaxial layer to form a compact semiconductor junction.
Optimized semiconductor layers enable ultra-fast breakover diodes to trigger below 0.3 microseconds, preventing thyristor overheating during voltage spikes.
Reduced n+ dopant concentration and deep insulating trenches in insulated gate turn-off thyristor edge cells.
An open drain output driver cell merges a reverse blocking diode within the drift region of a double-diffused metal oxide semiconductor structure.
A light emitting component integrates a voltage reducing layer with a smaller bandgap to lower thyristor drive voltage.
A metal-bond blade with a V-shaped point and fine abrasive particles cuts semiconductor wafers.