V-Shape Metal-Bond Blade for Semiconductor Wafer Dicing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing of semiconductor devices with low dielectric constant films, such as SiOC, faces challenges during the dicing process due to vulnerability of these films, leading to cracks, peeling, and blinding of the blade, which reduces cutting capacity and deteriorates the quality of the cutting surface.
Innovation Solution
A manufacturing method using a metal-bond blade with a V character-shaped point and fine abrasive particles, where the particle diameter is more than #3000, and the slitting depth is made deeper than the V character-shaped shoulder, to prevent blinding and improve cutting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin bonding blade is used to cut the wafer with low dielectric constant films, then peeling and crack generation of the film can be prevented, but blade consumption increases and durability decreases
Solution Approach 1:
The invention uses a composite blade structure combining a resin bonding layer and a metal bonding layer. The resin bonding layer prevents peeling and cracking of low dielectric constant films, while the metal bonding layer provides durability and reduces blade consumption. This composite structure resolves the contradiction between film protection and blade longevity.
2Reliability
If a metal-bond blade with V character form and small particle diameter is used to suppress peeling and crack, then film damage is reduced, but cutting scraps adhere to the blade surface causing blinding
Solution Approach 1:
The composite blade structure with resin bonding layer prevents cutting scraps from adhering to the blade surface, thereby preventing blinding while maintaining the benefits of metal-bond blades in suppressing peeling and crack of low dielectric constant films.
3Duration of action of moving object
If a metal-bond blade is used for cutting, then blade life is extended compared to resin bonding blade, but cutting capacity decreases due to blinding
Solution Approach 1:
The resin bonding layer in the composite blade prevents blinding by reducing adhesion of cutting scraps to the blade surface. This maintains cutting capacity over extended periods, allowing the blade to retain its cutting efficiency throughout its extended service life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents blinding, maintains cutting capacity, and enhances the quality of the cutting surface by reducing chipping and peeling of low dielectric constant films during the dicing process.
Implementation Method 1
using the V character-shaped first blade whose width of a flat surface of a point of a section vertical to a direction of movement is 40% or less of blade width, and whose fineness number of an abrasive particle is more than #3000
Data Source
AI summary
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer.When cutting a wafer, cutting is performed so that the portion of a V character-shaped shoulder may enter below the front surface of a wafer (depth Z2 from a substrate front surface) using the metal-bond blade which includes the abrasive particle whose fineness number is more than #3000, and whose point is V character form. By processing it in this way, cutting resistance goes up and blinding of a blade can be prevented. Hereby, the size of a chipping can be suppressed small, preventing blinding of a blade.