Semiconductor Light Emitting Element Flat Bonding Structure
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Solution Overview
Problem
Current semiconductor light emitting elements face challenges in efficiency due to stress and damage from uneven bonding surfaces and heat dissipation issues, which affect productivity and reliability.
Innovation Solution
The semiconductor light emitting element design includes a specific interconnect structure with non-overlapping conductive layers and an insulating layer, allowing for flat bonding surfaces and efficient heat dissipation, using nitride semiconductors and reflective materials for improved electrical and light reflectance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional bonding structures are used, then device assembly is simplified, but bonding surfaces become uneven causing stress and damage
Solution Approach 1:
The patent introduces a planarization layer that adds a new dimensional level to the bonding structure. This layer compensates for height differences in the interconnect structures, transforming the bonding problem from a vertical height-matching issue to a flat surface creation issue, thereby achieving both ease of manufacture and bonding surface uniformity
2Temperature
If heat dissipation structures are added, then thermal management improves, but device complexity increases
Solution Approach 1:
The patent makes the interconnect structures serve dual functions: electrical connection and heat dissipation. By integrating heat dissipation features into the existing interconnect layers rather than adding separate dedicated heat dissipation components, the patent improves thermal management while minimizing increases in device complexity
3Use of energy by moving object
If light extraction structures are added, then light extraction efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent optimizes light extraction by adjusting parameters of existing structures such as the refractive indices of materials, the thicknesses of layers, and the geometries of interconnect features. By tuning these parameters within standard manufacturing capabilities rather than introducing new complex structures, the patent improves light extraction efficiency while maintaining feasible manufacturing precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency, reduces stress and damage, and increases productivity and reliability by maintaining flat bonding surfaces and efficient heat dissipation.
Implementation Method 1
an insulating layer between the first conductive layer and the second conductive layer
Implementation Method 2
efficient heat dissipation
Implementation Method 3
reflective materials for improved electrical and light reflectance characteristics
Data Source
AI summary
A semiconductor light emitting element includes a base body, a first semiconductor layer, a second semiconductor layer, a first light emitting layer, a first conductive layer, a third semiconductor layer, a fourth semiconductor layer, a second light emitting layer, a second conductive layer, a first member, and a second member. The first member includes a first end portion and a second end portion. The first end portion is positioned between the base body and the first conductive layer and electrically connected to the first conductive layer, the second end portion not overlapping the second conductive layer. The second member includes a third end portion and a fourth end portion. The third end portion is positioned between the base body and the second conductive layer and electrically connected to the second conductive layer. The fourth end portion is electrically connected to the second end portion.