Semiconductor Light Emitting Device Package with Wavelength Conversion Substrate

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Solution Overview

Problem

Current methods for manufacturing semiconductor light emitting device packages face challenges in achieving precise color compensation and efficient light extraction, particularly in separating individual packages while maintaining optimal light transmissive and wavelength conversion properties.

Innovation Solution

The method involves forming light emitting structures with conductivity-type semiconductor layers and active layers, bonding a light transmissive substrate with wavelength conversion regions to the structures, and using a combination of micromachining and laser cutting to separate individual packages, with additional wavelength conversion regions applied as needed based on measured color characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a light transmissive substrate with wavelength conversion regions is bonded to multiple light emitting structures, then color compensation and light extraction efficiency are improved, but the complexity of separating individual packages increases

Engineering Contradiction:

Improvecolor compensation precisionVSAvoidpackage separation complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The light transmissive substrate is divided into multiple regions, each corresponding to a light emitting structure. Wavelength conversion regions are formed in specific areas of the substrate, allowing individual package separation while maintaining color compensation functionality for each structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the light transmissive substrate have different properties - some regions contain wavelength conversion material while others are transparent. This local differentiation enables precise color compensation for each light emitting structure while facilitating selective separation of individual packages

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If wavelength conversion regions are formed by creating recesses and filling with wavelength conversion material, then color characteristics are precisely controlled, but the manufacturing process complexity increases

Engineering Contradiction:

Improvecolor characteristics precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Recesses are pre-formed in the light transmissive substrate at predetermined positions before bonding to the light emitting structures. This preliminary preparation allows for precise placement of wavelength conversion material and simplifies the overall manufacturing process by organizing steps in a logical sequence

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The recesses act as intermediaries between the light emitting structures and the wavelength conversion material. They provide a controlled environment for material deposition, ensuring precise color characteristics while simplifying the manufacturing process through structured material placement

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If additional wavelength conversion regions are bonded to compensate for color variations, then color consistency across packages is improved, but the number of manufacturing steps increases

Engineering Contradiction:

Improvecolor consistencyVSAvoidmanufacturing steps

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

Color characteristics of light emitting structures are measured, and based on the measurement results, additional wavelength conversion regions are selectively bonded to specific areas. This feedback-driven approach ensures color consistency across all packages while optimizing the manufacturing process by applying conversions only where needed

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables improved color compensation and light extraction efficiency, reducing manufacturing time and ensuring consistent color characteristics across semiconductor light emitting device packages.

Implementation Method 1

bonding a light transmissive substrate with a plurality of wavelength conversion regions corresponding to the plurality of light emitting structures, respectively

Methodology Applied

Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS9472729B2Method of manufacturing semiconductor light emitting device package including light transmissive substrate having wavelength conversion regions

Publication Date: 2016.10.18 SAMSUNG ELECTRONICS CO LTD

AI summary

A method of manufacturing a semiconductor light emitting device package includes arranging a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, bonding a light transmissive substrate to the plurality of light emitting structures, the light transmissive substrate having a plurality of wavelength conversion regions corresponding to the plurality of light emitting structures, respectively, removing the support substrate from the plurality of light emitting structures, and separating individual semiconductor light emitting device packages from one another by removing at least a portion of the light transmissive substrate.