Semiconductor Light Emitting Device With Segmented Reflection Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor light emitting devices have low light utilization efficiency due to light being emitted from the upper and lateral surfaces in non-parallel directions, leading to the need for complex reflection surfaces that increase device size and prevent close mounting of light emitting elements.
Innovation Solution
A semiconductor light emitting device with a light emitting element mounting member featuring depressed sections and a coating member with different reflection surfaces, where the second reflection surface has a smaller angle with respect to the optical axis than the first, allowing for closer mounting of elements and improved light directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the depressed section is made deep to reflect oblique light effectively, then light reflection efficiency improves, but the diameter of the opening increases preventing close mounting of light emitting elements
Solution Approach 1:
The reflection function is segmented into two distinct surfaces: the first reflection surface (inner wall of depressed section) handles lateral light reflection, while the second reflection surface (top surface) handles oblique light reflection. This segmentation allows each surface to be optimized independently, resolving the contradiction between reflection efficiency and opening size.
Solution Approach 2:
The solution moves from a single deep depressed section to a two-dimensional arrangement with both lateral and top reflection surfaces. By utilizing the top surface (another dimension) for oblique light reflection, the design avoids the need for excessive depth, thereby maintaining a compact opening diameter that allows close mounting of light emitting elements.
2Illumination intensity
If multiple light emitting elements are mounted on one mounting member to increase light intensity, then device size reduces, but heat dissipation becomes more difficult
Solution Approach 1:
The mounting member is segmented into multiple independent depressed sections, each housing a light emitting element. This segmentation provides individual heat dissipation zones for each element, preventing heat accumulation while maintaining high total light output through the array of elements.
Solution Approach 2:
Heat dissipation is enhanced by utilizing three-dimensional space through the depressed section structure. The vertical depth of the depressed sections provides additional surface area for heat dissipation away from the mounting member, allowing closer horizontal spacing of elements without compromising thermal management.
3Area of stationary object
If the reflection surface angle is reduced to decrease opening diameter, then mounting density improves, but light reflection from lateral surface becomes ineffective
Solution Approach 1:
The reflection function is divided between two surfaces with different orientations: the first reflection surface (lateral wall) maintains an angle optimized for lateral light reflection, while the second reflection surface (top surface) provides a different angle for oblique light. This segmentation allows each surface to optimize its reflection angle independently, resolving the contradiction between opening size and reflection effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-intensity, directive light emission with increased light utilization efficiency and reduced device size by allowing multiple light emitting elements to be mounted on a single member, while maintaining effective heat dissipation and reflection of light from both surfaces.
Implementation Method 1
inner wall surface of (i) each of the depressed sections and (ii) each of the through holes respectively form (i) a first reflection surface and (ii) a second reflection surface
Implementation Method 2
the second reflection surface has an angle with respect to an optical axis of the light emitting element smaller than an angle of the first reflection surface with respect to an optical axis of the light emitting element
Data Source
AI summary
A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted; and a coating member 4 which covers a surface of the light emitting element mounting member 3 where said light emitting elements 2 are mounted. In the semiconductor light emitting device 1, said light emitting element mounting member 3 is provided with depressed sections 7 at positions where said light emitting elements 2 are respectively mounted; said coating member 4 is provided with through holes at positions respectively corresponding to the depressed sections 7; inner wall surfaces of (i) each of the depressed sections 7 and (ii) each of the through holes respectively form (i) a first reflection surface 8 and (ii) a second reflection surface 9; and the second reflection surface 9 has an angle with respect to an optical axis of said light emitting element 2 smaller than an angle of said first reflection surface 8 with respect to an optical axis of said light emitting element 2.