Semiconductor Light Emitting Device Side Surface Extraction
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Solution Overview
Problem
Semiconductor light emitting devices with multiple elements face challenges in miniaturization while maintaining high luminance, as the size reduction of individual elements leads to decreased light emission and increased device size, hindering high-definition light distribution patterns.
Innovation Solution
The semiconductor light emitting device features a mounting substrate with multiple elements, each having a semiconductor structure layer with a recessed portion for light extraction, individual conducting wires for independent control, and reflecting mirrors for 100% reflectance at end surfaces, preventing crosstalk and enhancing light scattering at the recessed portion's bottom, which includes phosphor particles for wavelength conversion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the light emitting element is decreased to reduce device size, then the device size is reduced, but the luminance of light emitted from a single element is decreased
Solution Approach 1:
The patent extracts light from the side surface of the semiconductor structure layer rather than from the end surface, representing a dimensional change in light extraction. This side surface extraction allows compact arrangement of multiple elements while maintaining high luminance output from each element, resolving the contradiction between device miniaturization and luminance maintenance.
Solution Approach 2:
The patent forms a recessed portion at a specific location on the side surface of the semiconductor structure layer to concentrate light extraction. This localized modification creates a high-luminance region that can be efficiently coupled with optical systems, allowing small element size while maintaining high output luminance through optimized local light emission characteristics.
2Adaptability or versatility
If multiple light emitting elements are arranged side by side to achieve light distribution control, then light distribution variability is improved, but the device size increases
Solution Approach 1:
By extracting light from the side surface rather than end surface, the patent enables closer spacing of multiple elements in the array. This dimensional change in light extraction geometry allows higher element density while maintaining individual element luminance, thus achieving versatile light distribution control in a compact device footprint.
3Ease of manufacture
If end surfaces are used for light extraction, then light extraction is simple, but end surface damage due to COD (Catastrophic Optical Damage) occurs
Solution Approach 1:
The patent extracts light from the side surface of the semiconductor structure layer instead of the end surface, removing the problematic end surface from the light extraction function. This extraction of the light extraction function to a different location eliminates the COD issue while maintaining effective light output through the recessed portion on the side surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for miniaturization while maintaining high luminance, reducing the need for end surface damage considerations, suppressing crosstalk, and enabling efficient heat dissipation, thus achieving compact high-definition light distribution with reduced electric power consumption.
Implementation Method 1
the recessed portion can cause the light to be extracted as scattered light in a direction perpendicular to the semiconductor structure layer
Implementation Method 2
reflecting mirrors for 100% reflectance at end surfaces
Implementation Method 3
phosphor particles for wavelength conversion
Data Source
AI summary
A semiconductor light emitting device including a plurality of light emitting elements can be miniaturized while enabling to emit light with high luminance. The semiconductor light emitting device can include a mounting substrate, and a plurality of semiconductor light emitting elements mounted on the mounting substrate side by side, each of the semiconductor light emitting elements having a semiconductor structure layer that can include a first semiconductor layer of a first conductivity type, an active layer, and a second semiconductor layer of a second conductivity type opposite to the first conductivity type, which are layered in that order. Each of the semiconductor light emitting elements can have a resonator constituted by end surfaces of the semiconductor structure layer opposite to each other, and also has a recessed portion recessed from the surface of the second semiconductor layer toward the active layer.