Semiconductor Light-Emitting Device Substrate Piercing Electrical Path
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Solution Overview
Problem
Conventional semiconductor light-emitting devices face challenges in forming electrical connections through insulating substrates without damaging the semiconductor layers, particularly during the process of creating holes for rear electrodes, which can lead to layer damage and inefficiencies in current spreading and wire bonding.
Innovation Solution
A semiconductor light-emitting device design that includes a substrate piercing portion extending from the rear surface to the front surface, allowing for the formation of an electrical path using a conductive material, which connects to the semiconductor layers without removing the substrate, thereby minimizing damage and enhancing current distribution and reducing wire bonding needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hole is formed in the substrate by laser to create electrical connection, then electrical connection is achieved, but the semiconductor layers are damaged
Solution Approach 1:
The substrate piercing portion is formed before the semiconductor layers are grown on the substrate. This preliminary formation of the piercing portion allows subsequent electrical connection processes to proceed without laser irradiation that would damage the semiconductor layers, while still achieving the required electrical connectivity through the substrate.
2Ease of manufacture
If the substrate is removed to facilitate current spreading, then current spreading is improved, but laser damage occurs during substrate removal
Solution Approach 1:
The substrate piercing portion is formed in advance before semiconductor layer growth and device fabrication. This preliminary action enables current spreading pathways to be established without requiring later substrate removal by laser, thereby avoiding laser damage to the semiconductor layers while still achieving improved current spreading.
3Reliability
If wire bonding is used for electrical connection, then electrical connection is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the electrical connection function from the traditional wire bonding approach by forming conductive paths directly through the substrate via substrate piercing portions. This eliminates the need for separate wire bonding operations, reducing device complexity and manufacturing difficulty while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables stable electrical connections to the semiconductor layers without substrate removal, reducing damage risks and improving current spreading efficiency while minimizing wire bonding, facilitating the creation of flip chip-type packages with enhanced light extraction efficiency.
Implementation Method 1
an electrical path leading to the at least one semiconductor stacked body via the substrate piercing portion
Data Source
AI summary
The present disclosure relates to a semiconductor light-emitting device which includes: a substrate having a first surface and a second surface; at least one semiconductor stacked body disposed on the first surface of the substrate and each including an active layer and first and second semiconductor layers disposed on both sides of the active layer, the first semiconductor layer having first conductivity, the second semiconductor layer having second conductivity different than the first conductivity, the first semiconductor layer having an exposed surface; a substrate piercing portion leading from the second surface to the first surface with a spacing from the exposed surface and opened without being covered with the at least one semiconductor stacked body; and an electrical path leading to the at least one semiconductor stacked body via the substrate piercing portion.