Semiconductor Package Magnetic Warpage Control
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Solution Overview
Problem
Semiconductor packages face failures due to warpage of semiconductor chips, which existing techniques have not adequately addressed, leading to issues with connection terminal reliability.
Innovation Solution
Incorporating a configuration of magnetic substances on and around the semiconductor chip, including first, second, and third magnetic substances positioned at the chip's edges and center, with specific magnetic polarities to create repulsive and attractive forces that counteract warpage, thereby stabilizing the chip and preventing connection terminal failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic substances are added to the semiconductor chip structure, then warpage control and connection terminal reliability are improved, but device complexity increases
Solution Approach 1:
The magnetic substance is divided into multiple segments: first and second magnetic substances positioned at edge regions, and a third magnetic substance at the center region. This segmentation allows different regions of the chip to be addressed independently, enabling precise control of warpage while maintaining manageable device complexity through modular configuration.
Solution Approach 2:
Different magnetic substances are positioned at specific locations (edges vs. center) with potentially different magnetic properties to address local warpage characteristics. The first and second magnetic substances at edges counteract edge-wise warpage, while the third magnetic substance at center addresses central region warpage, providing localized quality control throughout the chip structure.
2Manufacturing precision
If multiple magnetic substances with specific polarities are configured, then warpage tempering effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
Magnetic substances are positioned and polarized in advance during the manufacturing process before the chip is finalized. The first, second, and third magnetic substances are pre-configured with specific polarities (first polarity, second polarity, and third polarity respectively) to create predetermined magnetic force patterns that will counteract warpage during subsequent processing and operation.
Solution Approach 2:
The invention utilizes magnetic field parameters (strength, direction, polarity) as controllable variables to temper warpage. By adjusting the polarity configuration of different magnetic substances and their spatial arrangement, precise control over the magnetic forces acting on the chip is achieved, enabling fine-tuned warpage compensation without requiring complex mechanical adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic substance configuration effectively tempers warpage in semiconductor chips, reducing the likelihood of connection terminal failures and enhancing the reliability of semiconductor packages.
Implementation Method 1
A lower end of the first magnetic substance may have the same magnetic pole or polarity as an upper end of the fourth magnetic substance that faces the lower end of the first magnetic substance. A lower end of the second magnetic substance may have the same magnetic pole or polarity as an upper end of the fifth magnetic substance that faces the lower end of the second magnetic substance. A lower end of the third magnetic substance may have a different or opposite magnetic pole or polarity from an upper end of the sixth magnetic substance that faces the lower end of the third magnetic substance.
Data Source
AI summary
Provided is a semiconductor device. A semiconductor chip is disposed on a substrate. A first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another are formed on the semiconductor chip. The first magnetic substance and the second magnetic substance can be adjacent an edge of the semiconductor chip. The third magnetic substance can be adjacent a center of the semiconductor chip. The third magnetic substance is between the first magnetic substance and the second magnetic substance.