Semiconductor Sub-Assembly Malleable Layer Pressure Distribution
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Solution Overview
Problem
Traditional semiconductor device designs face challenges in achieving uniform pressure distribution across multiple chips, leading to sub-optimal performance and reliability due to micron-level differences in component thickness and flatness variations, which are exacerbated in multi-chip stacks.
Innovation Solution
A semiconductor device sub-assembly that utilizes a flexible conductive malleable layer, coupled with a stand-off plate featuring holes, to achieve uniform pressure distribution by flexing the malleable layer into these holes, allowing for elastic and plastic deformation to ensure consistent pressure across all chips, thereby simplifying assembly and increasing packing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional rigid copper electrodes and mechanical strain buffers are used, then the structure is simple and manufacturing is easy, but the pressure distribution across chips is non-uniform due to micron-level thickness differences and surface flatness variations
Solution Approach 1:
The patent introduces a flexible malleable layer (such as copper or aluminum foil) between the rigid electrodes and the semiconductor chips. This flexible layer deforms under compression to accommodate variations in chip thickness and electrode flatness, distributing pressure uniformly across all chips. The flexible layer acts as a compliant interface that absorbs dimensional tolerances without requiring tight manufacturing controls on the rigid components.
Solution Approach 2:
The patent changes the mechanical parameter of the electrode structure by introducing a material with different elasticity and deformability characteristics. The malleable layer has high ductility and low yield strength compared to rigid copper electrodes, allowing it to undergo plastic deformation and conform to the actual contact surfaces, thereby equalizing pressure distribution across chips with varying dimensions.
2Power
If multiple chips are clamped in a single stack for series operation, then the current handling capability increases, but the pressure distribution becomes increasingly non-uniform due to the additive effect of tolerances within the stack
Solution Approach 1:
The flexible malleable layer is positioned at strategic locations within the multi-chip stack to compensate for cumulative tolerance effects. As pressure is applied to the stack, the flexible layer deforms to accommodate thickness variations across multiple chips and electrodes, ensuring uniform pressure distribution throughout the entire stack and enabling high-power series operation with improved reliability.
3Manufacturing precision
If tightly toleranced components are used to ensure uniform pressure distribution, then pressure uniformity improves, but the ease of manufacture decreases and component costs increase
Solution Approach 1:
The flexible malleable layer serves as a tolerance-absorbing element that allows the use of standard-tolerance rigid components. Instead of requiring tight tolerances on copper electrodes and clamp components, the design uses readily available materials with standard dimensional variations, significantly simplifying manufacturing and supply chain management while achieving uniform pressure distribution through the deformable interface.
4Manufacturing precision
If disc spring stacks are used to reduce force/displacement ratio and minimize pressure differences, then pressure uniformity improves, but the packing density of chips is limited due to the area required for bypass strips
Solution Approach 1:
The flexible malleable layer provides a more space-efficient solution compared to disc spring stacks. It achieves pressure equalization through direct deformation under the chips without requiring additional bypass strips or contoured metal sheets, thereby maximizing chip packing density while maintaining uniform pressure distribution across the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a substantially uniform pressure distribution, allowing for higher current ratings and improved reliability by accommodating variations in chip thickness and surface flatness, while simplifying the assembly process and maximizing chip packing density.
Implementation Method 1
allowing for elastic and plastic deformation to ensure consistent pressure across all chips
Implementation Method 2
allowing for elastic and plastic deformation to ensure consistent pressure across all chips
Implementation Method 3
achieve uniform pressure distribution by flexing the malleable layer into these holes
Data Source
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AI summary
We disclose herein a semiconductor device sub-assembly comprising: a plurality of semiconductor units laterally spaced to one another; a plurality of conductive blocks, wherein each conductive block is operatively coupled with each semiconductor unit; a conductive malleable layer operatively coupled with each conductive block, wherein the plurality of conductive blocks are located between the conductive malleable layer and the plurality of semiconductor units. In use, at least some of the plurality of conductive blocks are configured to apply a pressure on the conductive malleable layer, when a predetermined pressure is applied to the semiconductor device sub-assembly.