Semiconductor Metal Component Nickel Layer Segmentation
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Solution Overview
Problem
The existing techniques for forming nickel plating layers on metal components in semiconductor devices face challenges in reducing the thickness of the nickel layer without compromising solder wettability and bonding characteristics, as thinner layers may lead to copper diffusion and increased manufacturing costs with thicker layers.
Innovation Solution
A metal component with a nickel layer comprising a first nickel layer not containing phosphorus and a second nickel layer containing 0.01 to 1% phosphorus by weight, where the second nickel layer is formed on top of the first layer, inhibiting copper diffusion and oxidation, and a noble metal layer is added to maintain bonding and solder wettability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the nickel layer thickness is increased, then copper diffusion is prevented and bonding characteristics are maintained, but manufacturing cost increases
Solution Approach 1:
The nickel layer is divided into two distinct layers: a first nickel layer (without phosphorus) in direct contact with the copper base material, and a second nickel layer (with 0.01-1% phosphorus) on top. This segmentation allows each layer to perform its specific function - the first layer prevents copper diffusion while the second layer provides oxidation resistance and bonding characteristics - thereby achieving reliable bonding with reduced total thickness and lower cost.
Solution Approach 2:
Different regions of the nickel plating are given different compositions tailored to their specific functional requirements. The first nickel layer near the copper interface is optimized for diffusion prevention, while the second nickel layer exposed to the environment is optimized for oxidation resistance and solder wettability. This local quality differentiation enables effective protection with thinner overall layers, reducing manufacturing cost while maintaining reliability.
2Ease of manufacture
If the nickel layer thickness is reduced, then manufacturing cost decreases, but copper diffusion occurs and solder wettability deteriorates
Solution Approach 1:
The nickel layer is segmented into two functional layers where the second nickel layer containing phosphorus (0.01-1% by weight) is positioned to provide oxidation resistance and excellent solder wettability. This allows the total nickel thickness to be reduced while the phosphorus-containing layer ensures good solder bonding characteristics are maintained.
Solution Approach 2:
The phosphorus content in the second nickel layer is optimized within the range of 0.01-1% by weight to achieve the right balance between oxidation resistance and solder wettability. This parameter optimization allows for reduced nickel layer thickness while maintaining good solder bonding characteristics, thereby reducing manufacturing cost without sacrificing reliability.
3Reliability
If a single nickel layer is used, then the structure is simple, but it cannot simultaneously prevent copper diffusion and maintain good solder wettability with reduced thickness
Solution Approach 1:
The nickel plating is segmented into two layers with distinct compositions: the first nickel layer (without phosphorus) directly contacts the copper base material to prevent copper diffusion, while the second nickel layer (with 0.01-1% phosphorus) provides oxidation resistance and good solder wettability. This segmentation enables the structure to simultaneously achieve copper diffusion prevention and good solder characteristics with reduced total thickness.
Solution Approach 2:
The nickel plating structure uses a composite approach with two layers having different chemical compositions. The first layer is pure nickel or nickel-dominated without phosphorus, while the second layer contains phosphorus (0.01-1% by weight). This composite structure combines the advantages of both compositions to achieve multiple functions (diffusion barrier, oxidation resistance, good wettability) with reduced overall thickness, balancing complexity with performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduction in nickel layer thickness while maintaining excellent solder wettability and bonding characteristics, thereby reducing manufacturing costs and preventing copper diffusion, thus addressing the limitations of existing techniques.
Implementation Method 1
a second nickel layer containing 0.01 to 1% phosphorus by weight, which inhibiting copper diffusion and oxidation
Implementation Method 2
a second nickel layer containing 0.01 to 1% phosphorus by weight, which inhibiting copper diffusion and oxidation
Data Source
AI summary
There is provided a metal component used for manufacturing a semiconductor device, including: a base material having an electrical conductivity; a nickel layer formed on a surface of the base material and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer. The nickel layer includes a first nickel layer not containing phosphorus, and a second nickel layer containing 0.01 to 1 in percent by weight of phosphorus. According to the metal component of the present disclosure, a thickness of the nickel layer can be reduced while good characteristics can be maintained.