Reusable Parametric Models for Semiconductor Metrology
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current optical metrology methods for semiconductor fabrication are complex and error-prone when modeling complex device structures, requiring users to assemble and constrain primitive structural building blocks, leading to difficulties in ensuring model consistency and transferring models between users.
Innovation Solution
The development of re-useable, parametric models that simplify the model building process by allowing users to define complex device structures with optimized parameters, reducing the need for manual input and increasing computational efficiency, while enabling model sharing and collaboration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If users manually assemble primitive structural building blocks to model complex device structures, then modeling flexibility is achieved, but model building complexity and error probability increase significantly
Solution Approach 1:
The patent segments complex device structures into standardized sub-structure templates (e.g., mandrel, spacer, trench, bridge) that can be independently defined and then assembled. This segmentation allows users to work with pre-characterized building blocks rather than constructing entire complex structures from primitive geometric shapes, reducing model building complexity while maintaining flexibility through combinatorial assembly of templates.
2Manufacturing precision
If users manually constrain and parameterize primitive structural building blocks, then accurate geometric representation is achieved, but time and effort for model building increase
Solution Approach 1:
The patent implements preliminary action by pre-defining sub-structure templates with their geometric constraints, parameter relationships, and physical characteristics already established. Users can directly instantiate these templates with specific parameter values rather than manually constraining each primitive shape, significantly reducing model building time while maintaining geometric accuracy through the pre-validated template definitions.
3Reliability
If complex device structures are modeled using primitive building blocks, then comprehensive structural representation is achieved, but computational complexity increases
Solution Approach 1:
The patent merges multiple primitive geometric shapes into unified sub-structure templates (e.g., combining rectangles, triangles, and circles into a single mandrel template). This merging reduces the total number of discrete geometric objects that need to be processed computationally while maintaining comprehensive structural representation, as each template encapsulates the complete geometric definition of a physical structure component.
4Adaptability or versatility
If models are built from scratch for each project, then customization is achieved, but model transfer and reuse between users becomes difficult
Solution Approach 1:
The patent implements universality by creating a library of standardized sub-structure templates that can be applied across multiple projects and device types. These templates serve multiple functions: they can be instantiated with different parameter values for customization, assembled in various combinations for different structures, and transferred between users without loss of fidelity. This multi-functionality enables both project-specific customization and cross-project reuse.
Data Source
AI summary
Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.