Power Semiconductor Module with Integrated Capacitor for Noise and Thermal Management
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Solution Overview
Problem
Existing power semiconductor modules face challenges in reducing switching noise and thermal resistance, with noise filters being ineffective when external and thermal issues arising from reduced chip size and increased current density.
Innovation Solution
Incorporating a capacitor, preferably ceramic, in parallel with the power semiconductor chip, connected between the upper and lower substrates to reduce switching noise and thermal resistance, with specific capacitance and distance optimizations to minimize module size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a noise filter is installed outside the package of the power semiconductor module, then switching noise can be filtered, but the filtering effectiveness is insufficient and the module size increases
Solution Approach 1:
The patent integrates the noise filter capacitor directly inside the power semiconductor module package, merging the noise filtering function with the module structure. This internal integration provides two benefits: (1) the capacitor is positioned close to the switching element for effective noise filtering, and (2) the overall module size is reduced compared to external filter installations
2Volume of moving object
If the power semiconductor chip size is reduced to decrease module size, then current density increases, but thermal resistance increases and heat dissipation becomes problematic
Solution Approach 1:
The patent makes the capacitor serve multiple functions simultaneously: (1) noise filtering by being connected in parallel with the switching element, and (2) heat dissipation by providing an additional thermal conduction path from the power semiconductor chip to the heat sink. This multi-functionality allows small chip size to be maintained while managing thermal resistance through the capacitor's dual role as both electrical and thermal conductor
Solution Approach 2:
The capacitor acts as an intermediary element that provides an alternative thermal conduction path. By connecting the upper substrate (attached to chip) to the lower substrate (attached to heat sink), the capacitor mediates heat transfer from the chip to the heat sink, reducing thermal resistance without requiring larger chip dimensions
3Object-affected harmful factors
If ceramic capacitors are used instead of conventional capacitors, then switching noise reduction and thermal resistance reduction are achieved, but module cost increases
Solution Approach 1:
The patent optimizes the capacitor parameters (capacitance value, voltage rating, and physical dimensions) to achieve the desired noise filtering and thermal management performance while controlling cost. By carefully selecting capacitance values in the range of 100pF to 10nF and optimizing the capacitor size, the design balances performance requirements with manufacturing cost considerations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces switching noise by 10% to 30% and thermal resistance to 0.3°C/W or less, enabling a compact, low-noise, and cost-efficient power semiconductor module.
Implementation Method 1
a capacitor (17) connected in parallel circuit-wise to the power semiconductor chip (6) connects the upper substrate (12) and lower substrate (13)
Implementation Method 2
the thermal resistance of a path from the top of the power semiconductor chip via the conductors, upper substrate, and capacitor to the bottom of the lower substrate is 0.3°C/W or less
Data Source
AI summary
Embodiments of the invention provide a power semiconductor module wherein it is possible to reduce switching noise generated in a switching element, and at the same time, to reduce thermal resistance between a power semiconductor chip and an insulating substrate. In some embodiments, by a capacitor being installed between a printed substrate and an insulating substrate so as to be adjacent to a power semiconductor chip which is a switching element, it is possible to reduce switching noise generated in the switching element, and furthermore, it is possible to reduce thermal resistance between the power semiconductor chip and insulating substrate.