Semiconductor Module Mounting Structure With Cavity Heat Dissipator
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor module mounting structures are relatively thick due to the upright position of the heat dissipating member, which poses a challenge for reducing the overall profile.
Innovation Solution
A mounting structure featuring a substrate with a cavity in the thickness direction, where a heat dissipating member with a protruding portion is received, allowing the semiconductor module to be bonded to the protruding portion, and including a cooling passage for enhanced heat dissipation, along with an insulating layer and fastening member for reduced thickness and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat dissipating member is provided in an upright position with respect to the substrate, then heat dissipation effectiveness is improved, but the thickness of the mounting structure increases
Solution Approach 1:
The heat dissipating member is repositioned from an upright orientation (extending in the thickness direction) to a planar orientation (extending in the plane direction of the substrate). This dimensional change allows the heat dissipation function to be maintained while significantly reducing the thickness of the mounting structure, as the heat dissipating surface now lies flat against the substrate rather than projecting upward.
2Length of moving object
If the heat dissipating member is positioned in the plane direction of the substrate, then the thickness is reduced, but heat dissipation effectiveness may be compromised
Solution Approach 1:
The heat dissipating member is merged with the substrate by positioning it in the plane direction and securing it to the substrate surface. This integration allows the heat dissipating function to be combined with the substrate structure, maintaining effective heat dissipation through direct thermal contact while minimizing the overall thickness of the mounting structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a lower-profile semiconductor module mounting structure while maintaining effective heat dissipation through the use of a coolant in the cooling passage and insulating layers for improved mechanical and dielectric strength.
Implementation Method 1
a cooling passage 25 through which a coolant flows
Implementation Method 2
a cooling passage 25 through which a coolant flows
Implementation Method 3
an insulating layer disposed between the reverse surface of the substrate and the body portion of the heat dissipating member
Data Source
AI summary
A mounting structure for a semiconductor module, includes: a substrate having an obverse surface and a reverse surface facing away from each other in a thickness direction; a semiconductor module mounted on a side of the substrate toward which the obverse surface is directed; and a heat dissipating member that dissipates heat from the semiconductor module. The substrate has a cavity penetrating in the thickness direction. The heat dissipating member includes a body portion located on a side of the substrate toward which the reverse surface is directed, and a protruding portion received in the cavity. The semiconductor module is bonded to the protruding portion.