Semiconductor Module Circuit Board with Anchoring Resin
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Solution Overview
Problem
Conventional semiconductor modules face challenges with low heat capacity and high heat resistance, leading to inadequate heat dissipation and reliability issues due to thermal expansion differences between support substrates and conductive posts, resulting in potential damage and abnormal operation of semiconductor devices.
Innovation Solution
A circuit board and semiconductor module design featuring conductive posts and metal plates with anchoring and reinforcing resins, which mechanically connect and electrically insulate the metal plates, enhancing heat dissipation and long-term reliability by using solder connections and uneven surfaces on the conductive posts for increased contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional insulating support substrates and conductive posts are used, then electrical connection is achieved, but heat radiation capability is insufficient and thermal expansion differences cause warping and cracks
Solution Approach 1:
The patent employs a composite structure combining insulating support substrate, conductive posts, and anchoring resin to create a multi-material system that simultaneously addresses electrical insulation, thermal conduction, and mechanical stability. The anchoring resin specifically bridges the thermal expansion coefficient gap between the substrate and conductive posts, preventing warping and cracks while maintaining electrical connection reliability.
Solution Approach 2:
The anchoring resin acts as an intermediary material between the insulating support substrate and the conductive posts. It mediates the thermal expansion coefficient mismatch by providing a transition zone that accommodates differential expansion, thereby preventing warping and joint cracks while maintaining the electrical and thermal pathways.
2Power
If high load is imposed on semiconductor device, then power output increases, but heat capacity is low and heat resistance is high causing inadequate heat dissipation
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional insulating substrate by introducing a separate conductive post structure with enhanced thermal pathways. The conductive posts are specifically designed to conduct heat away from the semiconductor device to external heat sinks, separating the electrical support function from the thermal management function.
3Reliability
If positioning of insulating support substrate and conductive posts is rigid, then electrical connection is established, but thermal expansion differences cause warping and long-term reliability decreases
Solution Approach 1:
The patent changes the mechanical parameters of the anchoring resin, specifically its elasticity modulus and thermal expansion coefficient, to match intermediate values between the rigid support substrate and conductive posts. This parameter optimization allows the resin to flexibly accommodate thermal expansion differences while maintaining stable electrical connections under thermal cycling conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively disperses heat generated by semiconductor devices, providing enhanced reliability and stability against shocks and vibrations, ensuring long-term electrical connection reliability and preventing damage from high temperatures.
Implementation Method 1
an anchoring resin (21) between at least one of the first conductive post (31) and the second conductive post (32), the second conductive post (32) and the third conductive post (33), and the third conductive post (33) and the first conductive post (31), which mechanically connects and electrically insulates
Implementation Method 2
an anchoring resin (21) between at least one of the first conductive post (31) and the second conductive post (32), the second conductive post (32) and the third conductive post (33), and the third conductive post (33) and the first conductive post (31), which mechanically connects and electrically insulates
Implementation Method 3
a solder (25) is positioned on one end of the first through third conductive posts (31-33) and poured into contact parts with the first through third conductive posts (31-33) and the first through third metal plates (11-13)
Implementation Method 4
a surface (500s) of the flange (500) of the first through third conductive posts (31-33) and a surface (501s) of the head (501a) or the foot (501b) include uneven surfaces
Implementation Method 5
The design effectively disperses heat generated by semiconductor devices
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E
AI summary
A circuit board (10) comprises a first conductive post (31) for electrically connecting to the collector electrode of a semiconductor device (50), a first metal plate (11) connecting to the first conductive post (31), a second conductive post (32) for electrically connecting to the gate electrode (52) of the semiconductor device (50), a second metal plate (12) connecting to the second conductive post (32), a third conductive post (33) for electrically connecting to the emitter electrode (53) of the semiconductor device (50), and a third metal plate (13) connecting to the third conductive post (33).