3D Semiconductor Module Layout for Corner Stress Relief
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Solution Overview
Problem
Semiconductor modules experience corner stress due to varying coefficients of thermal expansion among materials, leading to mechanical failures such as cracking and delamination, which diminish reliability and performance.
Innovation Solution
A three-dimensional semiconductor module design with a bottom die, top die, and corner dummy dies, featuring corner rounding and misalignment of edges and corners to reduce stress, along with a process flow including plasma dicing, bonding, and forming passivation layers to alleviate corner stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor module design with aligned dies is used, then manufacturing process is simple, but corner stress leads to cracking and delamination
Solution Approach 1:
The patent applies asymmetry by intentionally misaligning the corner dies relative to the main semiconductor dies. Specifically, the corner dies are positioned such that their corners do not align with the corners of the main dies, creating an asymmetric structure that redistributes corner stress away from critical regions. This misalignment prevents the concentration of thermal expansion stresses at the corners, thereby reducing cracking and delamination while maintaining manufacturing feasibility.
Solution Approach 2:
The patent implements corner rounding on the semiconductor dies, where the sharp corners are replaced with curved surfaces. This curvature reduces the stress concentration that occurs at sharp corners during thermal cycling. The rounded corners distribute the thermal expansion forces more evenly, preventing crack initiation and propagation at the corner regions, thus improving module reliability.
2Reliability
If corner rounding is implemented, then crack risk is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies corner rounding with a radius that is sufficient to reduce stress concentration but not excessively large. The rounding radius is optimized to provide adequate stress relief while remaining within the capabilities of standard manufacturing processes. This partial action approach ensures that the corner rounding is effective for crack prevention without imposing overly stringent precision requirements that would complicate manufacturing.
3Adaptability or versatility
If dies with different thermal properties are stacked, then functionality is enhanced, but corner stress increases
Solution Approach 1:
The patent uses asymmetric positioning of corner dies with different thermal properties relative to the main dies. By misaligning the corner dies, the structure compensates for the thermal property differences through geometric asymmetry. This allows the module to integrate diverse functional components while the misaligned corner structure distributes the thermal expansion stresses generated by materials with different CTEs, preventing stress concentration and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces the risk of crack formation in passivation layers, enhancing the reliability and performance of the semiconductor module.
Implementation Method 1
a process flow including plasma dicing
Data Source
AI summary
A semiconductor module includes a first semiconductor die, a second semiconductor die on the first semiconductor die, and a first corner die adjacent the second semiconductor die on the first semiconductor die and including a first corner die first side, a first corner die second side and a first corner die corner side connecting the first corner die first side and the first corner die second side, wherein the first corner die is located over a side of the first semiconductor die.