Semiconductor Module Dual-Side Heat Dissipation Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor power modules face challenges in heat irradiation efficiency and thermal resistance due to limited thermal expansion coefficient matching between semiconductor chips and ceramic substrates, leading to potential thermal deformation and reduced long-term operation reliability.
Innovation Solution
A semiconductor module design featuring a substrate with a metal layer and insulating layer, including conductors and semiconductor packages with solder connections, and a third wiring that enhances heat irradiation by providing both downward and upward heat paths, reducing thermal resistance and improving heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation is achieved through a single path in conventional semiconductor modules, then the structure is simple, but the thermal resistance is high and heat irradiation efficiency is insufficient
Solution Approach 1:
The heat dissipation path is segmented into multiple independent paths: a first heat dissipation path through the lower surface of the ceramic substrate to the lower clamping plate, and a second heat dissipation path through the upper surface of the ceramic substrate to the upper clamping plate. This segmentation allows heat to be dissipated through multiple routes simultaneously, reducing thermal resistance and improving heat irradiation efficiency without creating an overly complex structure.
Solution Approach 2:
The invention transitions from a single-dimensional (one-path) heat dissipation approach to a multi-dimensional (multi-path) approach by utilizing both the upper and lower surfaces of the ceramic substrate for heat dissipation. This dimensional expansion allows heat to escape in multiple directions, significantly improving thermal management effectiveness.
2Reliability
If thermal expansion coefficient of ceramic plate is adjusted to match semiconductor chip, then long-term operation reliability is improved, but thermal deformation still occurs due to insufficient heat dissipation
Solution Approach 1:
The heat dissipation function is segmented across multiple components and paths: heat flows from the semiconductor chip through the ceramic substrate to both upper and lower clamping plates, and further to heat sinks. This segmented multi-path approach ensures efficient heat removal, preventing thermal accumulation and deformation while maintaining the thermal expansion coefficient matching between ceramic plate and semiconductor chip for long-term reliability.
Solution Approach 2:
The invention employs a composite structure combining ceramic substrate (for thermal expansion matching and electrical insulation), metal clamping plates (for mechanical strength and heat conduction), and heat sinks (for final heat dissipation). This composite material approach addresses both the thermal expansion matching requirement and the heat dissipation requirement, preventing thermal deformation while ensuring long-term operational reliability.
3Productivity
If heat is dissipated only from one side of the semiconductor chip, then the structure is simple, but thermal resistance is high and heat transfer efficiency is reduced
Solution Approach 1:
The heat dissipation structure is segmented into multiple independent thermal pathways: one path through the lower surface of the ceramic substrate to the lower clamping plate and heat sink, and another path through the upper surface to the upper clamping plate and heat sink. This segmentation enables parallel heat flow paths, doubling the effective heat dissipation capacity and significantly improving heat transfer efficiency.
Solution Approach 2:
The invention expands heat dissipation from a single-sided (one-dimensional) approach to a dual-sided (multi-dimensional) approach, utilizing both the upper and lower surfaces of the ceramic substrate as heat dissipation interfaces. This dimensional expansion effectively doubles the heat transfer area and improves overall heat transfer efficiency without proportionally increasing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a 22% reduction in thermal resistance and enhances heat irradiation efficiency by allowing heat to be dissipated from both sides of the semiconductor chip, reducing the risk of thermal deformation and improving the module's reliability and performance.
Implementation Method 1
a first solder member connecting the first surface of the semiconductor chip to the first copper foil
Implementation Method 2
the ceramic plate on which the semiconductor chip mounted is mounted on a metal base substrate through a solder member
Implementation Method 3
a heat sink connected to the fourth surface of the metal base substrate
Implementation Method 4
a heat sink connected to the fourth surface of the metal base substrate
Data Source
AI summary
A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.