Semiconductor Module Explosion Protection via Embedded Bonding Wires

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Solution Overview

Problem

Semiconductor modules are prone to explosions, which can damage their environment and are not adequately protected against such incidents, leading to contamination and potential harm.

Innovation Solution

A semiconductor module design featuring an explosion protection means, such as SiO2, embedded bonding wires over 80% of their length, and gas-filled cavities to manage pressure, along with structural elements like projections and grooves to withstand internal pressure, enhancing thermal conductivity and reducing pressure waves.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding wires are used to connect semiconductor chips to contact pieces, then electrical connectivity is achieved, but the module becomes vulnerable to explosion hazards from wire vaporization under overload conditions

Engineering Contradiction:

Improveexplosion protectionVSAvoidpressure wave strength

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an explosion protection means as an intermediary substance between the bonding wires and the upper contact piece. This mediator absorbs the energy from wire vaporization through controlled heat conduction, preventing direct transmission of pressure waves to the module housing and surrounding environment.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The explosion protection means utilizes materials whose thermal conductivity increases with temperature. As the temperature rises during an overload event, the material's ability to conduct heat improves, enhancing its capacity to absorb and dissipate vaporization energy dynamically rather than statically.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If the module housing is made robust to withstand pressure, then explosion protection is improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvepressure resistanceVSAvoidhousing structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements beforehand cushioning by providing a housing structure with predetermined deformation characteristics. The housing includes features like recesses and projection elements that are designed in advance to absorb and distribute pressure loads during an explosion event, rather than requiring the entire housing to be uniformly robust.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The housing is segmented into functional zones with different structural characteristics. The lower housing portion includes engagement features for the lower contact piece, while the upper portion has recesses for the upper contact piece. This segmentation allows each zone to be optimized for its specific function while collectively providing explosion protection.

Inventive Principle:

Principle #1Segmentation

3Ease of operation

If the bonding wire length is increased to connect distant contact pieces, then electrical connectivity is improved, but the risk of vaporization and explosion hazard increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidexplosion vulnerability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The explosion protection means serves as a mediator that decouples the relationship between bonding wire length and explosion hazard. By providing this intermediate heat-sinking layer, longer bonding wires can be used for electrical connectivity without proportionally increasing the explosion risk, as the mediator absorbs the vaporization energy regardless of wire length.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively delays vaporization and reduces pressure wave strength, providing enhanced explosion protection and containment within the module, thereby preventing environmental contamination.

Implementation Method 1

the explosion protection means acts as a heat sink for the bonding wire that vaporizes in the case of overload... its thermal conductivity increases as the temperature increases

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the semiconductor module having one or more gas-filled cavities in which pressure can be reduced by expansion... the product of pressure and volume is constant

Methodology Applied

Scientific EffectPressure reduction by expansion: Pressure Drop

Data Source

PatentUS8981545B2Explosion-protected semiconductor module

Publication Date: 2015.03.17 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor module includes an electrically conductive lower contact piece and an electrically conductive upper contact piece spaced apart from one another in a vertical direction. The module further includes a semiconductor chip having a first load connection and a second load connection. The semiconductor chip is electrically conductively connected by the second load connection to the lower contact piece, and electrically conductively connected to the upper contact piece by at least one bonding wire bonded to the first load connection. An explosion protection means is arranged between the first load connection and the upper contact piece and into which each of the bonding wires is embedded over at least 80% or over at least 90% of its length.