Semiconductor Module Heat Dissipation Insulation
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Solution Overview
Problem
Existing semiconductor modules are not applicable to vertical semiconductor elements and fail to ensure electrical insulation between the semiconductor element and the heat dissipation member when integrated onto a circuit board, as the insulating sheets used for insulation become brittle due to heat and lose their insulating properties.
Innovation Solution
A semiconductor module design that includes a semiconductor element, a first lead frame with a portion for mounting the element, a sealing member that integrates and insulates the heat dissipation member, and a bonding member for securing the module on a circuit board, ensuring electrical insulation without the need for an insulating sheet.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating sheet is disposed between the semiconductor element and the heat dissipation member to ensure electrical insulation, then electrical insulation is achieved, but the insulating sheet becomes brittle due to heat and loses its insulating properties when implemented onto a circuit board
Solution Approach 1:
The patent removes the insulating sheet from the structure entirely. Instead of using a separate insulating component that degrades under heat, the design integrates electrical insulation directly into the heat dissipation member through its structural configuration, eliminating the source of the reliability problem.
Solution Approach 2:
The patent combines the heat dissipation function and electrical insulation function into a single integrated component. The heat dissipation member is designed with an integrated insulation structure that provides both thermal management and electrical isolation, eliminating the need for separate insulating materials that fail under heat.
2Loss of energy
If the semiconductor element is in contact with the heat dissipation member for direct heat dissipation, then heat dissipation efficiency is improved, but the module becomes inapplicable to vertical semiconductor elements with electrodes on front and back surfaces
Solution Approach 1:
The patent segments the heat dissipation member into distinct functional regions: a contact portion that interfaces with the semiconductor element for heat transfer, and an integrated insulation structure that provides electrical isolation. This segmentation allows the same component to serve multiple functions and accommodate vertical semiconductor element configurations.
Solution Approach 2:
The patent transitions from a planar contact configuration to a three-dimensional integrated structure. The heat dissipation member extends in multiple dimensions, with the contact portion engaging the semiconductor element and the insulation structure providing vertical and lateral isolation, enabling compatibility with vertical mounting configurations.
3Reliability
If a separate insulating sheet is used to insulate the heat dissipation member from the semiconductor element, then electrical insulation is ensured, but the device complexity increases
Solution Approach 1:
The patent merges the heat dissipation member and insulation structure into a single integrated component, reducing the total component count and assembly complexity while maintaining reliable electrical insulation. This consolidation eliminates the need for separate insulating sheets and reduces assembly steps.
Solution Approach 2:
The heat dissipation member is designed to perform multiple functions simultaneously: heat dissipation through its contact portion and electrical insulation through its integrated insulation structure. This multi-functionality reduces the need for additional specialized components, simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for the effective application of the semiconductor module to vertical semiconductor elements by maintaining electrical insulation between the semiconductor element and the heat dissipation member, even when exposed to heat, thereby ensuring reliable operation on a circuit board.
Implementation Method 1
a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element
Data Source
AI summary
A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.