Semiconductor Module Heat Dissipation Sheet Design
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Solution Overview
Problem
In semiconductor modules, the reduction in the number of wires due to 'chip shrink' leads to increased heat generation and temperature rises in lead terminals and printed circuit boards, resulting in higher cooling costs, and existing solutions like adding a relay electrode increase production costs and complexity.
Innovation Solution
A semiconductor module design featuring an insulating heat dissipation sheet in direct contact with the die pad and wires bonded directly above the contact part between the die pad and heat dissipation sheet, allowing for improved heat dissipation without additional parts, reducing production steps and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a relay electrode is added on the heat dissipation sheet to dissipate wire heat, then heat dissipation is improved, but the number of parts and production steps increases, leading to higher production cost
Solution Approach 1:
The patent merges the heat dissipation function with the existing heat dissipation sheet by forming a conductive resin layer directly on it. The wire is bonded directly to the heat dissipation sheet through this conductive layer, eliminating the need for a separate relay electrode. This combines the heat dissipation path and electrical connection into a single integrated structure, reducing part count while maintaining effective heat dissipation.
Solution Approach 2:
The heat dissipation sheet is given multiple functions: it serves as both the heat dissipation substrate and the electrical connection carrier. The conductive resin layer on the heat dissipation sheet enables it to directly bond with the wire, making the heat dissipation sheet a multi-functional component that eliminates the need for dedicated relay electrodes.
2Power
If the number of wires is reduced to achieve chip shrink and high performance, then device performance is improved, but heat generation in wires increases, leading to temperature rises in lead terminals and printed circuit board
Solution Approach 1:
The patent introduces a new dimensional approach to heat dissipation by forming a conductive resin layer on the heat dissipation sheet that creates additional heat conduction pathways. This dimensional addition allows heat to be dissipated more efficiently from the wire bonding point directly into the heat dissipation sheet, preventing temperature rises without requiring more wires.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation, suppresses temperature rises in lead terminals and printed circuit boards, and is applicable to mass production by reducing the number of parts and production steps, thereby lowering manufacturing costs.
Implementation Method 1
the heat dissipation sheet is in direct contact with an undersurface of the die pad, and the wire is bonded to the die pad directly above a contact part provided between the die pad and the heat dissipation sheet. Thus, since heat generated in the wire during module operation is dissipated via the heat dissipation sheet
Data Source
AI summary
A semiconductor module includes: an insulating heat dissipation sheet; a semiconductor device provided on the heat dissipation sheet; a lead frame including a lead terminal and a die pad which are formed integrally; a wire connecting the lead frame to the semiconductor device and constituting a main current path; and a mold resin scaling the heat dissipation sheet, the semiconductor device, the lead frame and the wire, wherein the lead terminal is led out from the mold resin, the heat dissipation sheet is in direct contact with an undersurface of the die pad, and the wire is bonded to the die pad directly above a contact part provided between the die pad and the heat dissipation sheet.