Semiconductor Module Heat Sink Screw Fixation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules face issues with low heat conductivity due to the use of grease, increased component parts for warpage correction, and reduced layout flexibility, as well as potential deformation and breakage from soft gel bonding agents.
Innovation Solution
A semiconductor module design featuring a heat sink with fins, an insulating member, an electroconductive member, and a metal frame, covered by molding resin, with screws passing through peripheral holes for secure attachment to a cooling jacket, eliminating the need for grease and reducing component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If grease is used between the semiconductor module and heat sink, then bondability is improved, but heat releasability deteriorates due to low heat conductivity
Solution Approach 1:
The invention extracts and eliminates the grease layer from the thermal path between the semiconductor module and heat sink. By using a through-hole screw fixation method that directly contacts the heat sink surface, the patent removes the thermal barrier (grease) while maintaining bondability through mechanical fixation, thereby resolving the contradiction between ease of manufacture and heat releasability.
2Stability of the object's composition
If a pressing plate and screws are used to fix the semiconductor module, then warpage inhibition is achieved, but the number of component parts increases
Solution Approach 1:
The invention merges the fixation function into a single integrated component: the through-hole screw. Instead of using separate pressing plates and multiple screws, the patent combines the fixation and warpage inhibition functions into the screw itself, which passes through the semiconductor module and directly secures it to the heat sink, thereby reducing component parts while maintaining stability.
Solution Approach 2:
The through-hole screw serves multiple functions simultaneously: it provides mechanical fixation, inhibits warpage through direct contact pressure, and maintains thermal contact. This multi-functional design eliminates the need for separate pressing plates and additional components, resolving the contradiction between warpage inhibition and device complexity.
3Ease of manufacture
If a through hole is provided in the central portion of the semiconductor module for screw fixation, then fixation is achieved, but the degree of freedom of layout is reduced
Solution Approach 1:
The invention segments the fixation function from the central layout area by positioning through-holes at peripheral portions of the semiconductor module instead of the central portion. This segmentation allows the central area to remain free for component placement while achieving fixation through peripheral holes, thereby resolving the contradiction between fixation and layout freedom.
Solution Approach 2:
The invention changes the spatial dimension of fixation from central (planar constraint) to peripheral (boundary constraint). By moving the through-holes to the periphery, the fixation function is achieved without constraining the central layout area, effectively using dimensional repositioning to maintain both fixation and layout flexibility.
4Temperature
If an insulating substrate and heat sink are combined integrally, then the need for grease is eliminated, but the overall size increases due to resin case bonding
Solution Approach 1:
The invention extracts and eliminates the resin case bonding structure from the thermal path. By using a through-hole screw fixation method that directly contacts the heat sink, the patent removes the unnecessary resin case layer that increases overall size, while maintaining direct thermal contact between components, thereby resolving the contradiction between heat releasability and compact size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat releasability, improves layout flexibility, and inhibits deformation and breakage, while reducing assembly costs and increasing the module's strength.
Implementation Method 1
a fin (3) provided in a central portion of the heat release surface (2b)
Implementation Method 2
a fin (3) provided in a central portion of the heat release surface (2b)
Implementation Method 3
a hole (11) extending through a peripheral portion of the heat sink (2) and a peripheral portion of the molding resin (10), and the semiconductor module is mounted on a cooling jacket by passing a screw through the hole (11)
Data Source
AI summary
A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.