Semiconductor Module Heat-Transferring Parts Thermal Management
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Solution Overview
Problem
As solid state drives (SSDs) increase in speed and capacity, there is a growing need for improved heat-dissipation properties to manage the generated heat effectively, which existing technologies have not adequately addressed.
Innovation Solution
The semiconductor module incorporates a substrate with a control device, buffer semiconductor device, and memory devices, along with heat-transferring parts and pads that enhance thermal conductivity, including upper and lower heat-transferring parts with high thermal conductivity materials and shapes that extend to cover various components, and a case to enclose and protect the module, facilitating efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If solid state drives increase in speed and capacity, then read and write performance is improved, but heat generation increases and heat-dissipation property deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat-transferring parts (upper heat-transferring part and lower heat-transferring part) that can be separately designed and optimized. Each part contacts different components (memory devices, control device) and transfers heat to different locations, allowing targeted thermal management for different heat-generating elements.
Solution Approach 2:
Heat-transferring parts serve as intermediary elements between heat-generating components (memory devices, control device) and heat-dissipating structures. These intermediaries facilitate efficient thermal energy transfer from critical components to external heat sinks or dissipation paths without requiring direct contact between all components.
2Temperature
If heat-transferring parts with high thermal conductivity are added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat-transferring parts serve multiple functions: they transfer heat from various components (memory devices, control device), provide structural support, and can be integrated with existing substrate structures. This multi-functionality reduces the need for separate dedicated heat sink components, thereby limiting the increase in overall device complexity.
Solution Approach 2:
The upper and lower heat-transferring parts are merged with the substrate and component mounting structures to form an integrated thermal management system. Rather than adding completely separate heat sink assemblies, the thermal paths are combined with the existing mechanical structure, reducing overall complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the temperatures of the control device, buffer semiconductor device, and memory devices, improving heat dissipation and reliability, as demonstrated by simulation results showing lower temperatures compared to comparative examples without these heat-transferring features.
Implementation Method 1
a lower heat-transferring part configured to be in contact with at least one of the connector, the control device, the buffer semiconductor device, or the first memory device
Implementation Method 2
an upper heat-transferring part provided on the top surface of the substrate and contacting the second memory device
Data Source
AI summary
A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.