Power Semiconductor Module Insulating Layer Design
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Solution Overview
Problem
Power semiconductor module arrangements face issues with the formation of dendritic structures when exposed to corrosive gases and electric fields, which affect material properties and are costly to address.
Innovation Solution
A power semiconductor module arrangement that includes a base plate with a connecting element featuring a first electrically insulating layer, a second layer to attach the contact element to the insulating layer, and a third layer to attach the insulating layer to the base plate, eliminating the need for separate substrates and bonding wires, thereby preventing dendritic structure formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate substrates and bonding wires are used to connect contact element to semiconductor arrangement, then electrical connection is established, but dendritic structures form under corrosive gases and electric fields
Solution Approach 1:
The patent removes the separate substrate and bonding wire components from the conventional design. The contact element is directly integrated onto the main substrate, eliminating the intermediate substrate and wire bonding that create interfaces susceptible to dendritic formation. This extraction of problematic components directly addresses the harmful effect of dendritic structure formation while maintaining electrical connection functionality.
Solution Approach 2:
The patent merges the contact element directly onto the main substrate, combining functions that were previously separated into distinct components (contact element, separate substrate, bonding wires). This integration eliminates the interfaces between separate components where dendritic structures typically form, thereby improving reliability by removing the root cause of the harmful effect.
2Reliability
If multiple separate components (substrates, bonding wires) are used for connection, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple separate components (contact element, separate substrate, bonding wires) into a single integrated structure where the contact element is directly mounted on the main substrate. This merging reduces the total number of components and simplifies the overall device architecture, directly addressing the device complexity issue while maintaining the essential electrical connection function.
Solution Approach 2:
The patent extracts and removes unnecessary intermediate components (separate substrate and bonding wires) from the connection path. By taking out these redundant elements, the design achieves the same electrical connection function with fewer components, thereby reducing device complexity and manufacturing cost.
3Reliability
If multiple separate components (substrates, bonding wires) are used for connection, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the contact element directly onto the main substrate in a single manufacturing step, eliminating the need to separately manufacture and assemble multiple components (separate substrate, bonding wires). This consolidation reduces the number of manufacturing processes, material costs, and assembly operations, directly improving ease of manufacture while ensuring reliable electrical connection.
Solution Approach 2:
The patent extracts and eliminates unnecessary components (separate substrate and bonding wires) from the design. By removing these extra elements, the manufacturing process is simplified, material costs are reduced, and assembly operations are minimized, directly addressing the manufacturing cost issue while maintaining electrical connection reliability.
Data Source
Figure 1~2
Figure 3A~3D
AI summary
A power semiconductor module arrangement comprising a base plate to be arranged in a housing, a contact element to be arranged in the housing and configured to, when arranged within the housing, provide an electrical connection between the inside and the outside of the housing, wherein the contact element is formed separately from the housing, and a connecting element configured to connect the contact element to the base plate. The connecting element comprises a first electrically insulating layer, a second layer configured to attach the contact element to the first electrically insulating layer, and a third layer configured to attach the first electrically insulating layer to the base plate.