Power Semiconductor Module Lead Frame Heat Dissipation
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Solution Overview
Problem
Conventional power semiconductor modules suffer from inadequate heat dissipation performance and increased electromagnetic interference (EMI) noise due to the placement of heat dissipation means within the mold, which affects the module's ability to manage switching and conduction losses effectively.
Innovation Solution
The proposed solution involves a power semiconductor module design where a metal plate is insulated from the lead frame paddle and electrically connected to the power semiconductor die's electrodes, with leads extending from the paddle to improve heat dissipation and reduce EMI noise by exposing the lead frame paddle for external heat dissipation and connecting it to the source electrode, thereby reducing the module's vulnerability to EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation means is disposed within a mold, then the power semiconductor module has a compact structure, but the heat dissipation performance is insufficient
Solution Approach 1:
The heat dissipation means (lead frame paddle) is extracted from the enclosed mold structure and exposed to the exterior environment. The lead frame paddle extends outward from the mold to directly contact the heat sink, allowing heat to be dissipated to the external environment rather than being confined within the mold cavity. This extraction resolves the contradiction by prioritizing heat dissipation performance over compact enclosed structure.
2Object-affected harmful factors
If heat dissipation means is disposed within a mold, then the module structure is simplified, but electromagnetic interference (EMI) noise is amplified
Solution Approach 1:
The lead frame paddle is extracted from the mold enclosure and extended to the exterior, where it can be properly grounded and shielded. By taking out the heat dissipation means from the confined mold space, the structure allows for better EMI management through external grounding paths and reduced antenna effects, resolving the contradiction between structural simplicity and EMI control.
Solution Approach 2:
The lead frame paddle serves as an intermediary element that bridges the internal power semiconductor components and the external heat sink while providing a controlled path for electromagnetic interference. It acts as a mediator that can be separately optimized for both thermal conduction and EMI shielding functions, allowing the mold structure to remain simple while EMI is managed through the intermediary lead frame design.
3Temperature
If heat dissipation means is disposed within a mold, then manufacturing is simplified, but heat dissipation performance is reduced
Solution Approach 1:
The lead frame paddle is extracted from the mold cavity and extended to the exterior, where it can be directly bonded to the heat sink in a separate manufacturing step. This extraction allows the molding process to focus on encapsulating only the necessary components, while the heat dissipation path is established through a simplified external bonding operation, resolving the contradiction between manufacturing simplicity and heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation performance and reduces EMI noise by allowing for more effective thermal conductivity and minimizing the module's susceptibility to electromagnetic interference.
Implementation Method 1
a metal plate disposed on the lead frame paddle in a state of being insulated from the lead frame paddle
Implementation Method 2
a metal plate disposed on the lead frame paddle in a state of being insulated from the lead frame paddle
Data Source
AI summary
The present disclosure provides a power semiconductor module in which a lead frame paddle is extended to form a source lead, a source electrode of a power semiconductor die is electrically connected to the lead frame paddle, a drain electrode is insulated from the lead frame paddle, and a part of the lead frame paddle is exposed to the outside of a mold.