Semiconductor Module Lead Layout for Low-Profile Package Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor modules face challenges in downsizing and lowering the height due to the perpendicular orientation of lead portions in insertion-type semiconductor packages, which complicates the integration with heat radiation fins and board mounting, making it difficult to achieve compact designs.
Innovation Solution
A semiconductor module design that incorporates a board with a hole portion allowing the body portion of semiconductor packages to be inserted, with lead portions extending horizontally along the board surface and bonded to wiring portions, eliminating the need for bending and enabling common heat radiation fins without spacers or machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead portions of insertion-type semiconductor packages are disposed perpendicular to the board surface, then bonding reliability is improved, but module height increases and downsizing becomes difficult
Solution Approach 1:
The lead portions are configured to extend in the planar direction (horizontal dimension) rather than the vertical direction, changing the orientation from perpendicular to parallel with the board surface. This dimensional reorientation allows the module height to be reduced while maintaining bonding functionality through horizontal extension along the board surface.
2Length of stationary object
If lead portions are extended laterally along the board surface, then module height is reduced, but the lead portions must be bent which complicates manufacturing
Solution Approach 1:
The lead portions are pre-configured in a plate shape that extends from the side surface of the body portion, with the lower surface designed to be bonded to the wiring portion. This preliminary configuration eliminates the need for bending operations during assembly, as the lead portions are already in their final extended horizontal position.
3Device complexity
If heat radiation fins are shared by multiple semiconductor packages, then component count is reduced, but spacers or machining work is required which increases manufacturing complexity
Solution Approach 1:
The heat radiation fin is designed as a universal component that can be commonly used by multiple semiconductor packages. The fin structure incorporates multiple mounting surfaces at different positions, allowing different types of semiconductor packages (insertion-type and face-mounting-type) to be mounted on the same fin without requiring spacers or additional machining work.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves downsizing and lowering of the semiconductor module height by aligning heat radiation fin mounting surfaces and simplifying the bonding process, reducing operational steps and ensuring stable connections.
Implementation Method 1
a lower surface of the lead portion is bonded to the wiring portion
Data Source
AI summary
A semiconductor module includes: a board that includes a wiring portion formed on at least one surface and a hole portion having an opening on the at least one surface side; and a body portion that is disposed on one surface side of the board and is sealed by a resin, and a lead portion having a plate shape that extends toward an outside from a side surface of the body portion. In at least one semiconductor package, a part of the body portion is inserted into the hole portion, and the lead portion extends along a surface of the board, and a lower surface of the lead portion is bonded to the wiring portion.