Semiconductor Module Sealing With Adsorbent Moisture Barrier
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Solution Overview
Problem
The entry of moisture or corrosive gases into semiconductor modules can lead to corrosion of conductive elements and deterioration of insulation due to gaps formed between sealing materials and mounting substrates, compromising the integrity of the semiconductor module.
Innovation Solution
The semiconductor module incorporates a mounting substrate with a semiconductor element housed in a frame-shaped housing, featuring a lid, insulating sealing material, and an adsorbent disposed between the lid and sealing material to absorb penetrating substances, along with protective measures such as grooves and protrusions to contain the adsorbent and a protector covering external terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor element is housed in a frame-shaped housing with sealing material, then the semiconductor element is protected and insulated, but penetrating substances such as moisture or corrosive gases can still enter and cause corrosion or insulation degradation
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the sealing material and the mounting substrate. This resin layer fills gaps and prevents penetrating substances from reaching the mounting substrate and semiconductor element, while maintaining the sealing structure's integrity and insulation properties.
Solution Approach 2:
The resin layer is applied in advance to the mounting substrate before assembling the sealing material. This creates a pre-existing protective barrier that cushions against the harmful effects of penetrating substances before they can cause corrosion or insulation degradation.
2Reliability
If sealing material is used to seal the semiconductor element, then insulation is maintained, but gaps may form between the sealing material and mounting substrate allowing penetrating substance entry
Solution Approach 1:
The resin layer serves as a mediator that fills the gaps between the sealing material and mounting substrate. This eliminates voids where penetrating substances could accumulate while preserving the electrical insulation function of the sealing structure.
Solution Approach 2:
The resin layer is selectively applied to specific regions where gaps are likely to form between the sealing material and mounting substrate. This localized treatment addresses the gap formation issue without compromising the overall sealing and insulation structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the entry and adhesion of moisture and corrosive gases, preventing corrosion and insulation degradation, thereby reducing the risk of electrical failures like discharge or migration between elements.
Implementation Method 1
a first adsorbent disposed between the lid and the insulating sealing material and swollen by adsorption
Data Source
AI summary
A semiconductor module includes: a mounting substrate including a mounting surface; a semiconductor element disposed on the mounting surface; a housing for the semiconductor element; a lid fixed to the housing and facing the mounting surface; an insulating sealing material disposed in a space inside the housing and sealing the semiconductor element; and a first adsorbent disposed between the lid and the insulating sealing material and is swollen by adsorption.